TLMG3102-GS08, TLMG3102M-GS08, TLMK3100 Selling Leads, Datasheet
MFG:VISHAY Package Cooled:3225 D/C:06NOPB
TLMG3102-GS08, TLMG3102M-GS08, TLMK3100 Datasheet download
Part Number: TLMG3102-GS08
MFG: VISHAY
Package Cooled: 3225
D/C: 06NOPB
MFG:VISHAY Package Cooled:3225 D/C:06NOPB
TLMG3102-GS08, TLMG3102M-GS08, TLMK3100 Datasheet download
MFG: VISHAY
Package Cooled: 3225
D/C: 06NOPB
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: TLMA3100
File Size: 79759 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLMA3100
File Size: 79759 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLMK3100
File Size: 69133 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
This device has been designed to meet the increasing demand for AlInGaP technology.
The package of the TLMK3100 is the PLCC2(equivalent to a size B tantalum capacitor).
It consists of a lead frame which is surrounded with a white thermoplast. The reflector inside this package is filled up with clear epoxy.
Parameter |
Test Conditions |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
5 |
V | |
DC forward current |
Tamb 60 |
IF |
30 |
mA |
Surge forward current |
tp 10 s |
IFSM |
0.1 |
A |
Power dissipation |
Tamb 60 |
PV |
80 |
mW |
Junction temperature |
Tj |
100 |
||
Operating temperature range |
Tamb |
40 to +100 |
||
Storage temperature range |
Tstg |
55 to +100 |
||
Soldering temperature |
t 5 s |
Tsd |
260 |
|
Thermal resistance junction/ambient |
mounted on PC board (pad size > 16 mm2) |
RthJA |
400 |
K/W |
SMD LED with exceptional brightness
Luminous intensity categorized
Compatible with automatic placement equipment
EIA and ICE standard package
Compatible with infrared, vapor phase and wave solder processes according to CECC
Available in 8 mm tape
Low profile package
Non-diffused lens: excellent for coupling to light pipes and backlighting
Low power consumption
Luminous intensity ratio in one packaging unit IVmax/IVmin 2.0