Features: SMD LED with exceptional brightness Compatible with automatic placement equipment EIA and ICE standard package Compatible with infrared, vapor phase and wave solder processes according to CECC Available in 8 mm tape Low profile package Non-diffused lens: excellent for coupling to light ...
TLMC3100: Features: SMD LED with exceptional brightness Compatible with automatic placement equipment EIA and ICE standard package Compatible with infrared, vapor phase and wave solder processes according to...
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SMD LED with exceptional brightness
Compatible with automatic placement equipment
EIA and ICE standard package
Compatible with infrared, vapor phase and wave solder processes according to CECC
Available in 8 mm tape
Low profile package
Non-diffused lens: excellent for coupling to light pipes and backlighting
Very low power consumption
Luminous intensity ratio in one packaging unit IVmax/IVmin 2.0
Parameter |
Test Conditions |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
6 |
V | |
DC forward current |
IF |
7 |
mA | |
Surge forward current |
tp 10 s |
IFSM |
0.5 |
A |
Power dissipation |
Tamb 90 |
PV |
20 |
mW |
Junction temperature |
Tj |
100 |
||
Operating temperature range |
Tamb |
40 to +100 |
||
Storage temperature range |
Tstg |
55 to +100 |
||
Soldering temperature |
t 5 s |
Tsd |
260 |
|
Thermal resistance junction/ambient |
mounted on PC board (pad size > 16m2) |
RthJA |
500 |
K/W |
These new devices have been designed to meet the increasing demand for low current SMD LEDs.
The package of the TLMC3100 is the PLCC2(equivalent to a size B tantalum capacitor).
The TLMC3100 consists of a lead frame which is surrounded with a hite thermoplast. The reflector inside this package is illed up with clear epoxy.