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T5551, T555200-DAE, T5557

T5551, T555200-DAE, T5557 Selling Leads, Datasheet

MFG:N/A  Package Cooled:N/A  D/C:100000

T5551, T555200-DAE, T5557 Picture

T5551, T555200-DAE, T5557 Datasheet download

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Part Number: T5551

 

MFG: N/A

Package Cooled: N/A

D/C: 100000

 

 

 
 
 
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  • T5504ML

  • Vendor: lucent Pack: PLCC D/C: 04+& Qty: 242 Note: New & original own stock  Adddate: 2024-12-26
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  • Huyuan Technology Limited   China
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  • T5504MLDT

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  • First IC   China
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  • T5504ML-DT

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About T5551

PDF/DataSheet Download

Datasheet: T5551

File Size: 94059 KB

Manufacturer: Atmel

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T555200-DAE Suppliers

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  • T5504ML

  • Vendor: lucent Pack: PLCC D/C: 04+& Qty: 242 Note: New & original own stock  Adddate: 2024-12-26
  • Inquire Now
  • Huyuan Technology Limited   China
    Contact: Ms.AbbyZ   MSN:janhoo888@hotmail.com
    Tel: 86-755-83649255
    Fax: 86-755-8364/9248
    (12)
  • T5504ML

  • Vendor: lucent Qty: 6,000  Adddate: 2024-12-26
  • Inquire Now
  • RSI   United
    Contact: Mr.John Jardine  
    Tel: 011-310-325-2955
    Fax: 011-310-325-1738
    (33)
  • T5504MLDT

  • Pack: PLCC D/C: 03+& Qty: 6000 Note: Original  Adddate: 2024-12-26
  • Inquire Now
  • First IC   China
    Contact: Mr.hary ho  
    Tel: 86-021-13764939
    Fax:
    (4)
  • T5504ML-DT

  • Pack: PLCC D/C: 03+& Qty: 3000 Note: Original  Adddate: 2024-12-26
  • Inquire Now
  • First IC   China
    Contact: Mr.hary ho  
    Tel: 86-021-13764939
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About T5504

PDF/DataSheet Download

Datasheet: T5504

File Size: 233786 KB

Manufacturer: Agere

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T5557 Suppliers

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  • T5504ML

  • Vendor: lucent Pack: PLCC D/C: 04+& Qty: 242 Note: New & original own stock  Adddate: 2024-12-26
  • Inquire Now
  • Huyuan Technology Limited   China
    Contact: Ms.AbbyZ   MSN:janhoo888@hotmail.com
    Tel: 86-755-83649255
    Fax: 86-755-8364/9248
    (12)
  • T5504ML

  • Vendor: lucent Qty: 6,000  Adddate: 2024-12-26
  • Inquire Now
  • RSI   United
    Contact: Mr.John Jardine  
    Tel: 011-310-325-2955
    Fax: 011-310-325-1738
    (33)
  • T5504MLDT

  • Pack: PLCC D/C: 03+& Qty: 6000 Note: Original  Adddate: 2024-12-26
  • Inquire Now
  • First IC   China
    Contact: Mr.hary ho  
    Tel: 86-021-13764939
    Fax:
    (4)
  • T5504ML-DT

  • Pack: PLCC D/C: 03+& Qty: 3000 Note: Original  Adddate: 2024-12-26
  • Inquire Now
  • First IC   China
    Contact: Mr.hary ho  
    Tel: 86-021-13764939
    Fax:
    (4)

About T5557

PDF/DataSheet Download

Datasheet: T5557

File Size: 728816 KB

Manufacturer: ATMEL [ATMEL Corporation]

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T5551 General Description

The micromodule T5551 is the standard package for TEMIC Semiconductors' contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 m thin, thus opening the way to contactless card applications. The module includes the IC e5551 and an internal 435 pF capacitor.

T5551 Maximum Ratings

Parameter Symbol Value Unit
Max. DC current into coil 1/ coil 2 Icoil 10 mA
Max. AC current into coil 1/ coil 2 icoil 20 mApp
Power dissipation (dice) Ptot 100 mW
Operating ambient temperature range Tamb 40 to +85
Storage temperature range Tstg 40 to +125
Maximum assembly temperature > 5 min Tsld +150

T5551 Features

Universal metal leadframe packaging for all identification applications, especially for contactless cards and small coins
Optimized mechanical stability
With internal 435 pF capacitor
Designed for high volumes
Overall thickness 400 m

T5557 General Description

The T5557 is a contactless R/W IDentification IC (IDIC) for applications in the125 kHz frequency range. A single coil, connected to the chip, serves as the IC'spower supply and bi-directional communication interface. The antenna and chiptogether form a transponder or tag.

The on-chip 330-bit EEPROM (10 blocks, 33 bits each) can be read and written block-wise from a reader. Block 0 is reserved for setting the operation modes of the T5557tag. Block 7 may contain a password to prevent unauthorized writing.Data is transmitted from the IDICusing load modulation. This is achieved by dampingthe RF field with a resistive load between the two terminals Coil 1 and Coil 2. The ICreceives and decodes 100% amplitude modulated (OOK) pulse interval encoded bitstreams from the base station or reader.

T5557 Maximum Ratings

Parameters

Symbol

Value

Unit

aximum DC current into Coil 1/ Coil 2

Icoil

20

mA

Maximum AC current into Coil 1/ Coil 2, f = 125 kHz

Icoil PP

20

mA

Power dissipation (dice)
1)

Ptot

100

mW

Electrostatic discharge maximum to
MIL-Standard 883 C method 3015

Vmax

4000

V

Operation ambient temperature range

Tamb

-40 to +85

°C

Storage temperature range (data retention reduced)

Tstg

-40 to +150

°C

T5557 Features

• Contactless Read/Write Data Transmission
• Radio Frequency fRF from 100 kHz to 150 kHz
• e5550 Binary Compatible or T5557 Extended Mode
• Small Size, Configurable for ISO/IEC 11784/785 Compatibility
• 75 pF On-chip Resonant Capacitor (Mask Option)
• 7 x 32-bit EEPROM Data Memory Including 32-bit Password
• Separate 64-bit memory for Traceability Data
• 32-bit Configuration Register in EEPROM to Setup:Data Rate- RF/2 to RF/128, Binary Selectable or- Fixed e5550 Data Rates Modulation/Coding- FSK, PSK, Manchester, Biphase, NRZ Other Options- Password Mode- Max Block Feature- Answer-On-Request (AOR) Mode- Inverse Data Output- Direct Access Mode- Sequence Terminator(s)- Write Protection (Through Lock-bit per Block)- Fast Write Method (5 kbps versus 2 kbps)- OTP Functionality- POR Delay up to 67 ms

T5557 Connection Diagram

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