T5551

Features:

Universal metal leadframe packaging for all identification applications, especially for contactless cards and small coins
Optimized mechanical stability
With internal 435 pF capacitor
Designed for high volumes
Overall thickness 400 m


Specifications

Parameter	Symbol	Value	Unit
Max. DC current into coil 1/ coil 2	Icoil	10	mA
Max. AC current into coil 1/ coil 2	icoil	20	mApp
Power dissipation (dice)	Ptot	100	mW
Operating ambient temperature range	Tamb	40 to +85
Storage temperature range	Tstg	40 to +125
Maximum assembly temperature > 5 min	Tsld	+150

Description

The micromodule T5551 is the standard package for TEMIC Semiconductors' contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 m thin, thus opening the way to contactless card applications. The module includes the IC e5551 and an internal 435 pF capacitor.