SI5445BDC-T1-E3, SI5445DC, SI5445DC-T1. Selling Leads, Datasheet
MFG:VISHAY Package Cooled:MLP-8 D/C:07+
SI5445BDC-T1-E3, SI5445DC, SI5445DC-T1. Datasheet download
Part Number: SI5445BDC-T1-E3
MFG: VISHAY
Package Cooled: MLP-8
D/C: 07+
SI5445BDC-T1-E3, SI5445DC, SI5445DC-T1.
- Table of contents:
Info of SI5445BDC-T1-E3
Info of SI5445DC
Info of SI5445DC-T1.
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About SI5010
PDF/DataSheet Download
Datasheet: SI5010
File Size: 289324 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
About SI5445DC
PDF/DataSheet Download
Datasheet: SI5445DC
File Size: 106955 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
About SI5010
PDF/DataSheet Download
Datasheet: SI5010
File Size: 289324 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
SI5445DC Maximum Ratings
| Parameter | Symbol | 5 secs | Steady State | Unit | |
| Drain-Source Voltage | VDS | -8 | V | ||
| Gate-Source Voltage | VGS | ±8 | |||
| Continuous Drain Current (TJ = 150)a | TA = 25 | ID | ±7.1 | ±5.2 | A |
| TA = 85 | ±5.2 | ±3.7 | |||
| Pulsed Drain Current(10 s Pulse Width) | IDM | ±20 | |||
| Continuous Source Current (Diode Conduction)a | IS | -2.1 | -1.1 | ||
| Maximum Power Dissipationa | TA = 25 | PD | 2.5 | 1.3 | W |
| TA = 85 | 1.3 | 0.7 | |||
| Soldering Recommendations (Peak Temperature)b, c | 260 | ||||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 to 150 | |||
Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
SI5445DC Connection Diagram
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