SFF9240, SFF9244, SFF9250 Selling Leads, Datasheet
MFG:FAIRCHILD Package Cooled:TO-247 D/C:09+
SFF9240, SFF9244, SFF9250 Datasheet download
Part Number: SFF9240
MFG: FAIRCHILD
Package Cooled: TO-247
D/C: 09+
SFF9240, SFF9244, SFF9250
- Table of contents:
Info of SFF9240
Info of SFF9244
Info of SFF9250
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About SFF9240
PDF/DataSheet Download
Datasheet: SFF9240
File Size: 213022 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About SFF9244
PDF/DataSheet Download
Datasheet: SFF9244
File Size: 210604 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About SFF9250L
PDF/DataSheet Download
Datasheet: SFF9250L
File Size: 559735 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
SFF9240 Maximum Ratings
|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
-200 |
V |
|
ID |
Continuous Drain Current (TC=25) |
-7.6 |
A |
| Continuous Drain Current (TC=100) |
-5.3 | ||
|
IDM |
Drain Current-Pulsed |
30 |
A |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulsed Avalanche Energy |
770 |
mJ |
|
IAR |
Avalanche Current |
-7.6 |
A |
|
EAR |
Repetitive Avalanche Energy |
6.0 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
-5.0 |
V/ns |
|
PD |
Total Power Dissipation (TC=25) Linear Derating Factor |
60 0.48 |
W W/°C |
|
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
°C |
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/18" from case for 5-seconds |
300 |
SFF9240 Features
` Avalanche Rugged Technology
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -200V
` Lower RDS(ON) : 0.344 (Typ.)
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -200V
` Lower RDS(ON) : 0.344 (Typ.)
SFF9244 Maximum Ratings
|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
-250 |
V |
|
ID |
Continuous Drain Current (TC=25) |
-6.0 |
A |
| Continuous Drain Current (TC=100) |
-4.1 | ||
|
IDM |
Drain Current-Pulsed |
24 |
A |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulsed Avalanche Energy |
450 |
mJ |
|
IAR |
Avalanche Current |
-6.0 |
A |
|
EAR |
Repetitive Avalanche Energy |
6.0 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
-4.8 |
V/ns |
|
PD |
Total Power Dissipation (TC=25) Linear Derating Factor |
60 0.48 |
W W/°C |
|
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
°C |
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/18" from case for 5-seconds |
300 |
SFF9244 Features
` Avalanche Rugged Technology
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -250V
` Lower RDS(ON) : 0.549 (Typ.)
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -250V
` Lower RDS(ON) : 0.549 (Typ.)
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