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RFP47N10, RFP4N05, RFP4N05L

Table of contents:
Info of RFP47N10
Info of RFP4N05
Info of RFP4N05L

RFP47N10, RFP4N05, RFP4N05L Selling Leads, Datasheet

MFG:INTESIL Package Cooled:TO-220 D/C:04+

RFP47N10, RFP4N05, RFP4N05L Datasheet download

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Part Number: RFP47N10

MFG: INTESIL

Package Cooled: TO-220

D/C: 04+

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RFP4N05 Maximum Ratings

	RFP4N05	RFP4N06	UNITS
Drain to Source Voltage (Note 1) VDSS	50	60	V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR	50	60	V
Continuous Drain Current ID	4	4	A
Pulsed Drain Current (Note 3) IDM	10	10	A
Gate to Source Voltage VGS	±20	±20	V
Maximum Power Dissipation PD	25	25	W
Linear Derating Factor	0.2	0.2	W/^oCaaa
Operating and Storage Temperature .TJ, TSTG	-55 to 150	-55 to 150	^o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL	300	300	^oC
Package Body for 10s, See Techbrief 334 Tpkg	260	260	^o C

RFP4N05 Features

• 4A, 50V and 60V
• rDS(ON) = 0.800W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

RFP4N05L Maximum Ratings

	RFP4N05L	RFP4N06L	UNITS
Drain to Source Voltage (Note 1) VDSS	50	60	V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR	50	60	V
Continuous Drain Current ID	4	4	A
Pulsed Drain Current (Note 3) IDM	10	10	A
Gate to Source Voltage VGS	±20	±20	V
Maximum Power Dissipation PD	25	25	W
Linear Derating Factor	0.2	0.2	W/^oCaaa
Operating and Storage Temperature .TJ, TSTG	-55 to 150	-55 to 150	^o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL	300	300	^oC
Package Body for 10s, See Techbrief 334 Tpkg	260	260	^o C

RFP4N05L Features

• 4A, 50V and 60V
• rDS(ON) = 0.800W
• Design Optimized for 5V Gate Drives
• Can be Driven Directly from QMOS, NMOS, TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power-Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

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