Features: • 12A, 80V and 100V• rDS(ON) = 0.200W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFM12N08 RFM12N10 RFP18N08 RFP18N10 UNITS Drain to Source Voltage (Note 1) VDSS 80 100 80 100 V Drain to...
RFP12N10: Features: • 12A, 80V and 100V• rDS(ON) = 0.200W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFM12N08 RFM12N10 ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
RFM12N08 | RFM12N10 | RFP18N08 | RFP18N10 | UNITS | |
Drain to Source Voltage (Note 1) VDSS | 80 | 100 | 80 | 100 | V |
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 80 | 100 | 80 | 100 | V |
Continuous Drain Current ID | 12 | 12 | 12 | 12 | A |
Pulsed Drain Current (Note 3) IDM | 30 | 30 | 30 | 30 | A |
Gate to Source Voltage VGS | ±20 | ±20 | ±20 | ±20 | V |
Maximum Power Dissipation PD | 75 | 75 | 60 | 60 | W |
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID | 0.6 | 0.6 | 0.48 | 0.48 | W/oC |
Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | oC |
Maximum Temperature for Soldering | |||||
Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | 300 | 300 | o C |
Package Body for 10s, See Techbrief 334 Tpkg | 260 | 260 | 260 | 260 | o C |