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RFP12N10

Features: • 12A, 80V and 100V• rDS(ON) = 0.200W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFM12N08 RFM12N10 RFP18N08 RFP18N10 UNITS Drain to Source Voltage (Note 1) VDSS 80 100 80 100 V Drain to...

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RFP12N10: Features: • 12A, 80V and 100V• rDS(ON) = 0.200W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFM12N08 RFM12N10 ...

RFP12N10 Data Sheet

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Part Number:
RFP12N10
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/26

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Product Details

Description



Features:

• 12A, 80V and 100V
• rDS(ON) = 0.200W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

  RFM12N08 RFM12N10 RFP18N08 RFP18N10 UNITS
Drain to Source Voltage (Note 1) VDSS 80 100 80 100 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR 80 100 80 100 V
Continuous Drain Current ID 12 12 12 12 A
Pulsed Drain Current (Note 3) IDM 30 30 30 30 A
Gate to Source Voltage VGS ±20 ±20 ±20 ±20 V
Maximum Power Dissipation PD 75 75 60 60 W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID 0.6 0.6 0.48 0.48 W/oC
Operating and Storage Temperature .TJ, TSTG -55 to 150 -55 to 150 -55 to 150 -55 to 150 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 300 300 300 o C
Package Body for 10s, See Techbrief 334 Tpkg 260 260 260 260 o C



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