R1004, R1006, R1007 Selling Leads, Datasheet
Package Cooled:TO-92 D/C:09+
Package Cooled:TO-92 D/C:09+
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Datasheet: R10
File Size: 155488 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: R10
File Size: 155488 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: R10
File Size: 155488 KB
Manufacturer:
Download : Click here to Download
Mimix Broadband's 30.0-46.0 GHz GaAs MMIC receiver has a noise figure of 3.5 dB and 18.0 dB image rejection across the band. This device is a three stage LNA followed by an image reject resistive pHEMT mixer and includes an integrated LO doubler and LO buffer amplifer. The image reject mixer eliminates the need for a bandpass filter after the LNA to remove thermal noise at the image frequency. The use of integrated LO doubler and LO buffer amplifier makes the provision of the LO easier than for fundamental mixers at these frequencies. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Supply Voltage (Vd) ...........+6.0 VDC
Supply Current (Id1,2), (Id3)..... 110, 180 mA
Gate Bias Voltage (Vg)..........+0.3 VDC
Input Power (RF Pin) ............+5 dBm
Storage Temperature (Tstg) .....-65 to +165
Operating Temperature (Ta) ..-55 to MTTF Table 3
Channel Temperature (Tch) ......MTTF Table3
(3) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.
Mimix Broadband's 18.0-25.0 GHz GaAs MMIC receiver has a noise figure of 2.5 dB and 15.0 dB image rejection across the band. This device is a two stage balanced LNA followed by an image reject subharmonicanti-parallel diode mixer and includes an integrated LO buffer amplifer. The image reject mixer eliminates the need for a bandpass filter after the LNA to remove thermal noise at the image frequency. The use of a sub-harmonic mixer makes the provision of the LO easier than for fundamental mixers at these frequencies. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses Mimix Broadband's 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Supply Voltage (Vd) | +4.5 VDC |
Supply Current (Id1,Id2) | 180, 165 mA |
Gate Bias Voltage (Vg) | +0.3 VDC |
Input Power (RF Pin) | 0.0 dBm |
Input Power (RF Pin) | -65 to +165 |
Operating Temperature (Ta) | -55 to MTTF Table3 |
Channel Temperature (Tch) | MTTF Table3 |
Mimix Broadband's 11.0-17.0 GHz GaAs MMIC receiver has a noise figure of 2.2 dB and 20.0 dB image rejection across the band. This device is a three stage LNA followed by an image reject resistive pHEMT mixer and includes an integrated LO buffer amplifer. The image reject mixer eliminates the need for a bandpass filter after the LNA to remove thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Supply Voltage (Vd) | +6.0 VDC |
Supply Current (Id1), (Id3) | 250, 200 mA |
Gate Bias Voltage (Vg) | +0.3 VDC |
Input Power (RF Pin) | +17 dBm |
Storage Temperature (Tstg) | -65 to +165 OC |
Operating Temperature (Ta) | -55 to MTTF Table 3 |
Junction Temperature (Tch) | MTTF Table 3 |
(3) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.
·Fully Integrated Design
·2.2 dB Noise Figure
·13.5 dB Conversion Gain
·20 dB Image Rejection
·+4 dBm IIP3
·+3 dBm LO drive Level
·100% On-Wafer RF, DC and Noise Figure Testing
·100% Visual Inspection to MIL-STD-883 Method 2010