MTP30P06, MTP30P06V, MTP33N Selling Leads, Datasheet
MFG:IR Package Cooled:TO-220 D/C:08+/09+
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MTP30P06, MTP30P06V, MTP33N Datasheet download
Part Number: MTP30P06
MFG: IR
Package Cooled: TO-220
D/C: 08+/09+
MFG:IR Package Cooled:TO-220 D/C:08+/09+
MTP30P06, MTP30P06V, MTP33N Datasheet download
MFG: IR
Package Cooled: TO-220
D/C: 08+/09+
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PDF/DataSheet Download
Datasheet: MTP30P06
File Size: 195585 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MTP30P06V
File Size: 195585 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MTP33N10
File Size: 246166 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
60 |
Vdc |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
60 |
Vdc |
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 15 ± 25 |
Vdc VPK |
Drain Current - Continuous @ 25°C - Continuous@ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
30 19 105 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
125 0.83 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 175 |
°C |
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =25 Vdc, VGS = 10Vdc, PEAK IL =30Apk, L = 1.0mH, RG = 25) |
EAS |
450 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
RJC RJA |
1.2 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |
Rating |
Symbol |
Value |
Unit |
DrainSource Voltage |
VGSS |
60 |
Vdc |
DrainGate Voltage (RGS = 1.0 M) |
VDGR |
60 |
Vdc |
GateSource Voltage - Continuous - NonRepetitive (tp10ms) |
VGS VGSM |
±15 ±25 |
|
Drain - Continuous - Continuous @ 100°C - Single Pulse(tp10 s) |
ID ID IDM |
30 19 105 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
125 0.83 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ,Tstg |
55 to 150 |
°C |
Single DraintoSource Avalanche Energy - Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, IL =30 Apk, L = 1.0 mH, RG = 25) |
EAS |
450 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
RJC RJA |
1.2 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds |
TL |
260 |
°C |
New Features of TMOS V
• Onresistance Area Product about Onehalf that of Standard MOSFETs with New Low Voltage, Low RDS(on) Technology
• Faster Switching than EFET Predecessors
Features Common to TMOS V and TMOS EFETS
• Avalanche Energy Specified
• IDSS and VDS(on) Specified at Elevated Temperature
• Static Parameters are the Same for both TMOS V and TMOS EFET