MTP2N80, MTP2P50, MTP2P50E Selling Leads, Datasheet
MFG:MOT Package Cooled:TO-220 D/C:03+
MTP2N80, MTP2P50, MTP2P50E Datasheet download
Part Number: MTP2N80
MFG: MOT
Package Cooled: TO-220
D/C: 03+
MFG:MOT Package Cooled:TO-220 D/C:03+
MTP2N80, MTP2P50, MTP2P50E Datasheet download
MFG: MOT
Package Cooled: TO-220
D/C: 03+
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Datasheet: MTP 3-Phase Rectifier Series
File Size: 124897 KB
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Datasheet: MTP2P50
File Size: 236539 KB
Manufacturer: MOTOROLA [Motorola, Inc]
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PDF/DataSheet Download
Datasheet: MTP2P50E
File Size: 236539 KB
Manufacturer: MOTOROLA [Motorola, Inc]
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This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
500 |
Vdc |
DraintoGate Voltage (RGS =1.0 M) |
VDGR |
500 |
Vdc |
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 20 ± 40 |
Vdc VPK |
Drain Current - Continuous - Continuous@ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
2.0 1.6 6.0 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
75 0.6 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 150 |
°C |
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =100 Vdc, VGS =10Vdc, PEAK IL =4.0 Apk, L =10H, RG = 25) |
EAS |
80 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
RJC RJA |
1.67 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |
This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies,converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.
• Robust High Voltage Termination
• Avalanche Energy Specified
• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
Rating |
Symbol |
Value |
Unit |
DrainSource Voltage |
VGSS |
500 |
Vdc |
DrainGate Voltage (RGS = 1.0 M) |
VDGR |
500 |
Vdc |
GateSource Voltage - Continuous - NonRepetitive (tp10ms) |
VGS VGSM |
±20 ±40 |
|
Drain - Continuous - Continuous @ 100°C - Single Pulse(tp10 s) |
ID ID IDM |
2.0 1.6 6.0 |
Adc Apk |
Total Power Dissipation Derate above 25°C |
PD |
75 0.6 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ,Tstg |
55 to 150 |
°C |
Single DraintoSource Avalanche Energy - Starting TJ = 25°C (VDD = 100 Vdc, VGS = 10 Vdc, IL =4.0 Apk, L = 10 mH, RG = 25) |
EAS |
80 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient |
RJC RJA |
1.67 62.5 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds |
TL |
260 |
°C |