MGSF1N02E, MGSF1N02ECT1, MGSF1N02EL Selling Leads, Datasheet
MFG:PHILIPS/NXP Package Cooled:SOT23 D/C:09+
MGSF1N02E, MGSF1N02ECT1, MGSF1N02EL Datasheet download
Part Number: MGSF1N02E
MFG: PHILIPS/NXP
Package Cooled: SOT23
D/C: 09+
MFG:PHILIPS/NXP Package Cooled:SOT23 D/C:09+
MGSF1N02E, MGSF1N02ECT1, MGSF1N02EL Datasheet download
MFG: PHILIPS/NXP
Package Cooled: SOT23
D/C: 09+
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PDF/DataSheet Download
Datasheet: MGSF1N02EL
File Size: 119747 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MGS05N60D
File Size: 139157 KB
Manufacturer: ONSEMI [ON Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MGSF1N02EL
File Size: 119747 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
Rating | Symbol | Value | Unit |
Drain−to−Source Voltage | VDSS | 20 | Vdc |
Gate−to−Source Voltage − Continuous | VGS | ±8.0 | Vdc |
Drain Current - Continuous @ TA = 25°C Drain Current - Pulsed Drain Current (tp 10 ms) |
ID IDM |
750 2000 |
mA |
Total Power Dissipation @ TA = 25°C | PD | 400 | mW |
Operating and Storage Temperature Range |
TJ, Tstg | − 55 to150 | mW |
Thermal Resistance - JunctiontoAmbient | RJA | 300 | °C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds |
TL | 260 | °C |