LQFP, LQFP100L, LQFP100T19.7-2.0 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:50 D/C:N/A
LQFP, LQFP100L, LQFP100T19.7-2.0 Datasheet download
Part Number: LQFP
MFG: TOSHIBA
Package Cooled: 50
D/C: N/A
LQFP, LQFP100L, LQFP100T19.7-2.0
- Table of contents:
Info of LQFP
Info of LQFP100L
Info of LQFP100T19.7-2.0
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About LQFP
PDF/DataSheet Download
Datasheet: LQFP
File Size: 129957 KB
Manufacturer: STATSCHIP [STATS ChipPAC, Ltd.]
Download : Click here to Download
About LQFP
PDF/DataSheet Download
Datasheet: LQFP
File Size: 129957 KB
Manufacturer: STATSCHIP [STATS ChipPAC, Ltd.]
Download : Click here to Download
About LQFP
PDF/DataSheet Download
Datasheet: LQFP
File Size: 129957 KB
Manufacturer: STATSCHIP [STATS ChipPAC, Ltd.]
Download : Click here to Download
LQFP General Description
STATS ChipPAC's LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications.
LQFP Features
• Body Sizes: 7 x 7mm to 28 x 28mm
• Package Height: 1.4mm
• Lead Counts: 32L to 208L
• Lead Pitch: 0.80mm to 0.40mm
• Wide range of open tool leadframe and die pad sizes available
• Moisture Sensitivity: JEDEC Level 3
• JEDEC standard compliant
• Lead-free and Green materials sets available
• Copper and alloy leadframes availabl
• Package Height: 1.4mm
• Lead Counts: 32L to 208L
• Lead Pitch: 0.80mm to 0.40mm
• Wide range of open tool leadframe and die pad sizes available
• Moisture Sensitivity: JEDEC Level 3
• JEDEC standard compliant
• Lead-free and Green materials sets available
• Copper and alloy leadframes availabl
LQFP Typical Application
• 3D Graphics
• Multimedia
• PC Chipsets
• Video / Audio
• Telecom
• Disc Drives
• Communication Boards (Ethernet, ISDN)
• Multimedia
• PC Chipsets
• Video / Audio
• Telecom
• Disc Drives
• Communication Boards (Ethernet, ISDN)
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