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LQFP

Features: • Body Sizes: 7 x 7mm to 28 x 28mm• Package Height: 1.4mm• Lead Counts: 32L to 208L• Lead Pitch: 0.80mm to 0.40mm• Wide range of open tool leadframe and die pad sizes available• Moisture Sensitivity: JEDEC Level 3• JEDEC standard compliant•...

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SeekIC No. : 004399351 Detail

LQFP: Features: • Body Sizes: 7 x 7mm to 28 x 28mm• Package Height: 1.4mm• Lead Counts: 32L to 208L• Lead Pitch: 0.80mm to 0.40mm• Wide range of open tool leadframe and die p...

LQFP Data Sheet

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Part Number:
LQFP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• Body Sizes: 7 x 7mm to 28 x 28mm
• Package Height: 1.4mm
• Lead Counts: 32L to 208L
• Lead Pitch: 0.80mm to 0.40mm
• Wide range of open tool leadframe and die pad sizes available
• Moisture Sensitivity: JEDEC Level 3
• JEDEC standard compliant
• Lead-free and Green materials sets available
• Copper and alloy leadframes availabl


Application

• 3D Graphics
• Multimedia
• PC Chipsets
• Video / Audio
• Telecom
• Disc Drives
• Communication Boards (Ethernet, ISDN)


Description

STATS ChipPAC's LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications.




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