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Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
IRFR1010ZPBF Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25
Continuous Drain Current VGS@ 10V (Silicon Limited)
91
A
ID @ TC = 100
Continuous Drain Current, VGS@10V
65
ID @ TC = 25
Continuous Drain Current VGS@ 10V (Package Limited)
42
IDM
Pulsed Drain Current
360
PD @ TC = 25
Power Dissipation
140
W
Linear Derating Factor
0.9
W/
VGS
Gate-to-Source Voltage
±20
V
EAS (Thermally limited)
Single Pulse Avalanche Energy
110
mJ
EAS (Tested)
Single Pulse Avalanche Energy Tested Value
220
IAR
Avalanche Current
See Fig.12a,12b,15,16
A
EAR
Repetitive Avalanche Energy
mJ
TJ TSTG
Operating Junction Storage Temperature Range
-55 to + 175
Soldering Temperature, for 10 seconds
300 (1.6mm from case)
Mounting Torque, 6-32 or M3 screw
10 lbfin (1.1Nm)
IRFR1010ZPBF Features
` Advanced Process Technology ` Ultra Low On-Resistance ` 175 Operating Temperature ` Fast Switching ` Repetitive Avalanche Allowed up to Tjmax ` Lead-Free