Features: ·HERMETICALLY SEALED SURFACE MOUNT PACKAGE·SMALL FOOTPRINT - C EFFICIENT USE O PCB SPACE.·SIMPLE DRIVE REQUIREMENTS·LIGHTWEIGHT·HIGH PACKING DENSITIESSpecifications VGS Gate - Source Voltag ±20 ID Continuous Drain Current(VGS = 0 , Tcase = 25 45A ID Continuous Drain Curre...
IRF054SMD: Features: ·HERMETICALLY SEALED SURFACE MOUNT PACKAGE·SMALL FOOTPRINT - C EFFICIENT USE O PCB SPACE.·SIMPLE DRIVE REQUIREMENTS·LIGHTWEIGHT·HIGH PACKING DENSITIESSpecifications VGS Gate - Source...
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VGS | Gate - Source Voltag | ±20 |
ID | Continuous Drain Current(VGS = 0 , Tcase = 25 |
45A |
ID | Continuous Drain Current(VGS = 0 , Tcase = 100 | 28A |
IDM | PulsedDrain Current 1 | 180A |
PD | Power Dissipation @ Tcase = 25 |
100W |
Linear Derating Factor | 0.8W/ | |
EAS | Single Pulse Avalanche Energy 2 | 480mJ |
dv/dt | Peak Diode Recovery 3 | 4.5V/ns |
TJ , Tstg | Operating and Storage Temperature Range | -55 to 150 |
TL | Package Mounting Surface Temperature (for5 sec) | 300 |
RJC | Thermal Resistance Junction to Case | 1.25/W |
RJ-PCB | Thermal Resistance Junction to PCB (Typical) | 4/W |