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These are P-Channel enhancement mode silicon gate power field effect transistors. They are advanced power MOSFETs designed, tested, and guaranteed to withstand a specified level of energy in the breakdown avalanche mode of operation. All of these power MOSFETs are designed for applications such as switching regulators, switching convertors, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. They can be operated directly from integrated circuits.
Formerly Developmental Type TA17521.
IRF9540 Maximum Ratings
IRF9540, RF1S9540SM
UNITS
Drain to Source Breakdown Voltage (Note 1) . . . . . VDS
-100
V
Drain to Gate Voltage (RGS = 20k) (Note 1) . .. .. . . .VDGR
Single Pulse Avalanche Energy Rating (Note 4). . .. . EAS
960
mJ
Operating and Storage Temperature . . . . . . . . TJ, TSTG
-55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . .TL
300
Package Body for 10s, See Techbrief 334 . . . . . . . Tpkg
260
IRF9540 Features
• 19A, 100V • rDS(ON) = 0.200W • Single Pulse Avalanche Energy Rated • SOA is Power Dissipation Limited • Nanosecond Switching Speeds • Linear Transfer Characteristics • High Input Impedance • Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
IRF9540 Connection Diagram
IRF9540N Parameters
Technical/Catalog Information
IRF9540N
Vendor
International Rectifier
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
P-Channel
Drain to Source Voltage (Vdss)
100V
Current - Continuous Drain (Id) @ 25° C
23A
Rds On (Max) @ Id, Vgs
117 mOhm @ 11A, 10V
Input Capacitance (Ciss) @ Vds
1300pF @ 25V
Power - Max
140W
Packaging
Bulk
Gate Charge (Qg) @ Vgs
97nC @ 10V
Package / Case
TO-220-3 (Straight Leads)
FET Feature
Standard
Lead Free Status
Contains Lead
RoHS Status
RoHS Non-Compliant
Other Names
IRF9540N IRF9540N
IRF9540N General Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
IRF9540N Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ -10V
-23
A
ID @ TC = 100°C
Continuous Drain Current, VGS @ -10V
-16
IDM
Pulsed Drain Current
-76
PD @TC = 25°C
Power Dissipation
140
W
Linear Derating Factor
0.91
W/
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy
430
mJ
IAR
Avalanche Current
-11
A
EAR
Repetitive Avalanche Energy
14
mJ
dv/dt
Peak Diode Recovery dv/dt
-5.0
V/ns
TJ TSTG
Operating Junction and Storage Temperature Range
-55 to + 175
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Mounting torque, 6-32 or M3 srew
10 lbf•in (1.1N•m)
IRF9540N Features
·Advanced Process Technology ·Dynamic dv/dt Rating ·175°C Operating Temperature ·Fast Switching ·P-Channel ·Fully Avalanche Rated