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he IRF6601 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packagingto achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFETpackage is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase,infra-red or convection soldering techniques. The DirectFET package allows dual sided cooling to maximize thermal transfer n power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6601 balances both low resistance and low charge along with ultra low package inductance to reduce both conductionand switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power thelatest generation of processors operating at higher frequencies. The IRF6601 has been optimized for parameters that arecritical in synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6601offers particularly low Rds(on) and high Cdv/dt immunity for synchronous FET applications.
IRF6601 Maximum Ratings
Parameter
Max
Units
VDS
Drain-to-Source Voltage
20
V
ID @ TC =25°C
Continuous Drain Current, VGS @ 10 V
85
ID @ TC =25°C
Continuous Drain Current, VGS @ 10 V
26
ID @ TC =70°C
Continuous Drain Current, VGS @ 10 V
20
IDM
Pulsed Drain Current
200
PD @TA = 25°C
Power Dissipation
3.6
W/
PD @TA = 70°C
Power Dissipation
2.3
PD @TA = 25°C
Power Dissipation
42
Linear Derating Factor
28
VGS
Gate-to-Source Voltage
±20
A
TJ TSTG
Operating Junction and Storage Temperature Range
-55 to + 150
IRF6601 Features
· Application Specific MOSFETs · Ideal for CPU Core DC-DC Converters · Low Conduction Losses · Low Switching Losses · Low Profile (<0.7 mm) · Dual Sided Cooling Compatible · Compatible with exisiting Surface Mount echniques