HWD2188SQ, HWD2190, HWD2190ITL Selling Leads, Datasheet
MFG:7 Package Cooled:SOP-8 D/C:09+
HWD2188SQ, HWD2190, HWD2190ITL Datasheet download
Part Number: HWD2188SQ
MFG: 7
Package Cooled: SOP-8
D/C: 09+
HWD2188SQ, HWD2190, HWD2190ITL
- Table of contents:
Info of HWD2188SQ
Info of HWD2190
Info of HWD2190ITL
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About HWD075DGE
PDF/DataSheet Download
Datasheet: HWD075DGE
File Size: 274246 KB
Manufacturer: POWER-ONE [Power-One]
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About HWD2190
PDF/DataSheet Download
Datasheet: HWD2190
File Size: 1305633 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
About HWD075DGE
PDF/DataSheet Download
Datasheet: HWD075DGE
File Size: 274246 KB
Manufacturer: POWER-ONE [Power-One]
Download : Click here to Download
HWD2190 General Description
The HWD2190 is an audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 1 watt of continuous average power to an 8
BTL load with less than 1% distortion (THD+N) from a 5VDC power supply.
audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components. The HWD2190 does not require output coupling capacitors or bootstrap capacitors, and therefore is ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.
The HWD2190 features a low-power consumption shutdown mode, which is achieved by driving the shutdown pin with logic low. Additionally, the HWD2190 features an internal thermal shutdown protection mechanism.
The HWD2190 contains advanced pop & click circuitry which eliminates noises which would otherwise occur during turn-on and turn-off transitions.
The HWD2190 is unity-gain stable and can be configured by external gain-setting resistors.
HWD2190 Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the CSMSC Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 11) 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD +0.3V
Power Dissipation (Note 3) Internally Limited
ESD Susceptibility (Note 4) 2000V
Junction Temperature 150°C
Thermal Resistance
JC (SOP) 35°C/W
JA (SOP) 150°C/W
JA (8 Bump micro SMD, Note 12) 220°C/W
JA (9 Bump micro SMD, Note 12) 180°C/W
JC (MSOP) 56°C/W
JA (MSOP) 190°C/W
JA (LLP) 220°C/W
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package."
See AN-1187 "Leadless Leadframe Package (LLP)."
please contact the CSMSC Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 11) 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD +0.3V
Power Dissipation (Note 3) Internally Limited
ESD Susceptibility (Note 4) 2000V
Junction Temperature 150°C
Thermal Resistance
JC (SOP) 35°C/W
JA (SOP) 150°C/W
JA (8 Bump micro SMD, Note 12) 220°C/W
JA (9 Bump micro SMD, Note 12) 180°C/W
JC (MSOP) 56°C/W
JA (MSOP) 190°C/W
JA (LLP) 220°C/W
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package."
See AN-1187 "Leadless Leadframe Package (LLP)."
HWD2190 Features
Available in space-saving packages: micro SMD, MSOP, SOIC, and LLP
Ultra low current shutdown mode
BTL output can drive capacitive loads
Improved pop & click circuitry eliminates noises during turn-on and turn-off transitions
2.2 - 5.5V operation
No output coupling capacitors, snubber networks or bootstrap capacitors required
Thermal shutdown protection
Unity-gain stable
External gain configuration capability
Ultra low current shutdown mode
BTL output can drive capacitive loads
Improved pop & click circuitry eliminates noises during turn-on and turn-off transitions
2.2 - 5.5V operation
No output coupling capacitors, snubber networks or bootstrap capacitors required
Thermal shutdown protection
Unity-gain stable
External gain configuration capability
HWD2190 Typical Application
Mobile Phones
PDAs
Portable electronic devices
PDAs
Portable electronic devices
HWD2190 Connection Diagram
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