Features: · LLP, MSOP, and SOP surface mount packaging· Switch on/off click suppression· Excellent power supply ripple rejection· Unity-gain stable· Minimum external componentsApplication· Headphone Amplifier· Personal Computers· Portable electronic devicesPinoutSpecificationsIf Military/Aerospace...
HWD2108: Features: · LLP, MSOP, and SOP surface mount packaging· Switch on/off click suppression· Excellent power supply ripple rejection· Unity-gain stable· Minimum external componentsApplication· Headphone...
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If Military/Aerospace specified devices are required, please contact the CSMSC Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD + 0.3V
Power Dissipation (Note 4) Internally limited
ESD Susceptibility (Note 5) 3500V
ESD Susceptibility (Note 6) 250V
Junction Temperature 150°C
Soldering Information (Note 1)
Small Outline Package
Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
Thermal Resistance
JC (MSOP) 56°C/W
JA (MSOP) 210°C/W
JC (SOP) 35°C/W
JA (SOP) 170°C/W
JC (LLP) 15°C/W
JA (LLP) 117°C/W (Note 9)
JA (LLP) 150°C/W (Note 10)
The HWD2108 is a dual audio power amplifier capable of delivering 105mWper channel of continuous average power into a 16W load with 0.1%(THD+N) from a 5V power supply. audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components using surface mount packaging. Since the HWD2108 does not require bootstrap capacitors or snubber networks, it is optimally suited for low-power portable systems.
The unity-gain stable HWD2108 can be configured by external gain-setting resistors.