HVC136, HVC142AKRF-E, HVC145TRF-E Selling Leads, Datasheet
MFG:RENESAS Package Cooled:09+ D/C:30000

HVC136, HVC142AKRF-E, HVC145TRF-E Datasheet download
Part Number: HVC136
MFG: RENESAS
Package Cooled: 09+
D/C: 30000
MFG:RENESAS Package Cooled:09+ D/C:30000
HVC136, HVC142AKRF-E, HVC145TRF-E Datasheet download
MFG: RENESAS
Package Cooled: 09+
D/C: 30000
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Datasheet: HVC136
File Size: 26257 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HVC08
File Size: 73598 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HVC08
File Size: 73598 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
Item |
Symbol |
Value |
Unit |
Peak reverse voltage |
VRM |
65 |
V |
Reverse voltage |
VR |
60 |
V |
Forward current |
IF |
100 |
mA |
Power dissipation |
Pd |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
−55 to +125 |
` Adopting the trench structure improves low capacitance.(C = 0.45 pF max)
` Low forward resistance. (rf = 2.5 max)
` Low operation current.
` Ultra small Flat Package (UFP) is suitable for surface mount design and stable rf characteristics in high frequency.