Features: ` Low capacitance.(C1=1.0pF max)` Low forward resistance. (rf=0.7 max)` Ultra small Flat Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value Unit Reverse voltage VR 30 V Power dissipation Pd 150 mW Junction temper...
HVC133: Features: ` Low capacitance.(C1=1.0pF max)` Low forward resistance. (rf=0.7 max)` Ultra small Flat Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value ...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
30 |
V |
Power dissipation |
Pd |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
-55 to +125 |