HVC133

Features: ` Low capacitance.(C1=1.0pF max)` Low forward resistance. (rf=0.7 max)` Ultra small Flat Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value Unit Reverse voltage VR 30 V Power dissipation Pd 150 mW Junction temper...

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HVC133 Picture
SeekIC No. : 004367694 Detail

HVC133: Features: ` Low capacitance.(C1=1.0pF max)` Low forward resistance. (rf=0.7 max)` Ultra small Flat Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value ...

floor Price/Ceiling Price

Part Number:
HVC133
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/18

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Product Details

Description



Features:

` Low capacitance.(C1=1.0pF max)
` Low forward resistance. (rf=0.7 max)
` Ultra small Flat Package (UFP) is suitable for surface mount design.





Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
30
V
Power dissipation
Pd
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to +125





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