FQD20N06, FQD20N06L, FQD20N06LE Selling Leads, Datasheet
MFG:FAI Package Cooled:SOT252 D/C:06+
FQD20N06, FQD20N06L, FQD20N06LE Datasheet download
Part Number: FQD20N06
MFG: FAI
Package Cooled: SOT252
D/C: 06+
MFG:FAI Package Cooled:SOT252 D/C:06+
FQD20N06, FQD20N06L, FQD20N06LE Datasheet download
MFG: FAI
Package Cooled: SOT252
D/C: 06+
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PDF/DataSheet Download
Datasheet: FQD20N06
File Size: 676487 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: FQD20N06L
File Size: 680643 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: FQD20N06LE
File Size: 671881 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive, DC/DC converters, and high efficiency switching for power management in portable and battery operated products.
Symbol | Parameter | FQD20N06 /FQU20N06 | Units |
VDSS | Drain-Source Voltage | 60 | V |
ID | Drain Current - Continuous (TC = 25) - Continuous (TC = 100) |
16.8 | A |
10.6 | A | ||
IDM | Drain Current - Pulsed (Note 1) | 67.2 | A |
VGSS | Gate-Source Voltage | ±25 | V |
EAS | Single Pulsed Avalanche Energy (Note 2) | 155 | mJ |
IAR | Avalanche Current (Note 1) | 16.8 | A |
EAR | Repetitive Avalanche Energy (Note 1) | 3.8 | mJ |
dv/dt | Peak Diode Recovery dv/dt (Note 3) | 7.0 | V/ns |
PD | Power Dissipation (TA = 25) * | 2.5 | W |
Power Dissipation (TC = 25) - Derate above 25 |
38 | W | |
0.30 | W/ | ||
TJ, TSTG | Operating and Storage Temperature Range | -55 to +150 | |
TL | Maximum lead temperature for soldering purposes, 1/8"from case for 5 seconds |
300 |
These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive, DC/ DC converters, and high efficiency switching for power management in portable and battery operated products.
IS |
Maximum Continuous Drain-Source Diode Forward Current |
- |
- |
17.2 |
A | |
ISM |
Maximum Pulsed Drain-Source Diode Forward Current |
- |
-- |
68.8 |
A | |
VSD |
Drain-Source Diode Forward Voltage |
VGS = 0 V, IS = 17.2A |
- |
- |
1.5 |
V |
trr |
Reverse Recovery Time |
VGS = 0 V, IF = 21 A, dIF / dt = 100 A/ìs (Note 4) |
- |
- |
- |
ns |
Qrr |
Reverse Recovery Charge |
- |
54 |
- |
nC |
These N-Channel enhancement mode power field effecttransistors are produced using Fairchild's proprietary,planar stripe, DMOS technology.
This advanced technology has been especially tailored tominimize on-state resistance, provide superior switching performance, and withstand high energy pulse in theavalanche and commutation mode. These devices are wellsuited for low voltage applications such as automotive, DC/DC converters, and high efficiency switching for power management in portable and battery operated products.
Symbol |
Parameter |
FQD13N06/FQU13N06 |
Units |
VDSS |
Drain-Source Voltage |
60 |
V |
ID |
Drain Current- Continuous (TC = 25)
- Continuous (TC= 100) |
17.2 |
A |
10.9 |
A | ||
IDM |
Drain Current Pulsed (Note 1) |
68.8 |
A |
VGSS |
Gate-Source Voltage |
±20 |
V |
EAS |
Single Pulsed Avalanche Energy (Note 2) |
170 |
mJ |
IAR |
Avalanche Current (Note 1) |
17.2 |
A |
EAR |
Repetitive Avalanche Energy (Note 1) |
3.8 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt (Note 3) |
7.0 |
V/ns |
PD |
Power Dissipation (TA = 25) * |
2.5 |
W |
Power Dissipation (TC = 25)
- Derate above 25 |
38 |
W | |
0.30 |
W/ | ||
TJ , TSTG |
Operating and Storage Temperature Range |
-55 to +150 |
|
TL |
Maximumleadtemperature for soldering purposes,
1/8" from case for 5 seconds |
300 |
17.2A, 60V, RDS(on)= 0.06 @ VGS= 10V
Low gate charge ( typical 9.5 nC)
Low Crss ( typical 35 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
150 C maximum junction temperature rating
Low level gate drive requirements allowing directoperation form logic drivers
Built-in ESD Protection Diode