FM51208S-250SC, FM550, FM56410C Selling Leads, Datasheet
MFG:01+ Package Cooled:09+ D/C:1000
FM51208S-250SC, FM550, FM56410C Datasheet download
Part Number: FM51208S-250SC
MFG: 01+
Package Cooled: 09+
D/C: 1000
FM51208S-250SC, FM550, FM56410C
- Table of contents:
Info of FM51208S-250SC
Info of FM550
Info of FM56410C
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About FM50
PDF/DataSheet Download
Datasheet: FM50
File Size: 336635 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About FM550
PDF/DataSheet Download
Datasheet: FM550
File Size: 82262 KB
Manufacturer: FORMOSA [Formosa MS]
Download : Click here to Download
About FM50
PDF/DataSheet Download
Datasheet: FM50
File Size: 336635 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
FM550 Maximum Ratings
| PARAMETER | CONDITIONS |
Symbol |
MIN. |
TYP. |
MAX. |
UNIT |
| Forward rectified current | See Fig.2 |
IO |
|
|
5.0 |
A |
| Forward surge current | 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) |
IFSM |
|
|
150 |
A |
| Reverse current | VR = VRRM TA = 25 |
IR
|
|
|
0.5 |
mA |
| VR = VRRM TA = 100 |
|
|
50 |
mA | ||
| Thermal resistance | Junction to ambient |
RthJA |
|
15 |
|
/ w |
| Diode junction capacitance | f=1MHz and applied 4vDC reverse voltage |
CJ |
|
380 |
|
pF |
| Storage temperature |
TSTG |
-55 |
|
+150 |
°C |
FM550 Features
·Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
·For surface mounted applications.
·Exceeds environmental standards of MIL-S-19500 / 228
·Low leakage current.
Retardant Epoxy Molding Compound.
·For surface mounted applications.
·Exceeds environmental standards of MIL-S-19500 / 228
·Low leakage current.
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