DG2799, DG2816, DG281AP/BP Selling Leads, Datasheet
MFG:Vishay Package Cooled:QFN-16 3x3 D/C:2010+
DG2799, DG2816, DG281AP/BP Datasheet download
Part Number: DG2799
MFG: Vishay
Package Cooled: QFN-16 3x3
D/C: 2010+
DG2799, DG2816, DG281AP/BP
- Table of contents:
Info of DG2799
Info of DG2816
Info of DG281AP/BP
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About DG2799
PDF/DataSheet Download
Datasheet: DG2799
File Size: 89026 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
About DG200
PDF/DataSheet Download
Datasheet: DG200
File Size: 92691 KB
Manufacturer: MAXIM [Maxim Integrated Products]
Download : Click here to Download
About DG200
PDF/DataSheet Download
Datasheet: DG200
File Size: 92691 KB
Manufacturer: MAXIM [Maxim Integrated Products]
Download : Click here to Download
DG2799 General Description
The DG2799 is a dual double-pole/double-throw monolithic CMOS analog switch designed for high performance switching of analog signals. Combining low power, high speed, low on-resistance and small physical size, the DG2799 is ideal for portable and battery powered applications requiring high performance and efficient use of board space.
The DG2799 is built on Vishay Siliconix's low voltage process. An epitaxial layer prevents latchup. Break-before-make is guaranteed.
The DG2799 is built on Vishay Siliconix's low voltage process. An epitaxial layer prevents latchup. Break-before-make is guaranteed.
DG2799 Maximum Ratings
Reference to GND
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +5.0 V
IN, COM, NC, NOa . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V+ + 0.3 V)
Current (Any terminal except NO, NC or COM) . . .. . . . . . . . . . . . . . . 30 mA
Continuous Current (NO, NC, or COM) . . . . . . . . . . . . . . . . . . . . . ±300 mA
Peak Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500 mA
(Pulsed at 1 ms, 10% duty cycle)
Storage Temperature (D Suffix) . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Package Solder Reflow Conditionsd
16-Pin QFN (3 x 3 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250°C
Power Dissipation (Packages)b
QFN-16c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . 1385 mW
Notes:
a. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC Board.
c. Derate 17.3 mW/C above 70C
d. Manual soldering with iron is not recommended for leadless components.The QFN is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.A solder fillet at the exposed copper lip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +5.0 V
IN, COM, NC, NOa . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V+ + 0.3 V)
Current (Any terminal except NO, NC or COM) . . .. . . . . . . . . . . . . . . 30 mA
Continuous Current (NO, NC, or COM) . . . . . . . . . . . . . . . . . . . . . ±300 mA
Peak Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500 mA
(Pulsed at 1 ms, 10% duty cycle)
Storage Temperature (D Suffix) . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Package Solder Reflow Conditionsd
16-Pin QFN (3 x 3 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250°C
Power Dissipation (Packages)b
QFN-16c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . 1385 mW
Notes:
a. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC Board.
c. Derate 17.3 mW/C above 70C
d. Manual soldering with iron is not recommended for leadless components.The QFN is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.A solder fillet at the exposed copper lip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
DG2799 Features
Low Voltage Operation (1.65 V to 4.3 V)
Low on-Resistance - rON: 0.25 @ 2.7 V
Fast Switching: tON = 28 ns tOFF = 17 ns
QFN-16 (3x3) Package
Latch-Up Current >300 mA (JESD78)
Low on-Resistance - rON: 0.25 @ 2.7 V
Fast Switching: tON = 28 ns tOFF = 17 ns
QFN-16 (3x3) Package
Latch-Up Current >300 mA (JESD78)
DG2799 Typical Application
Cellular Phones
Speaker Headset Switching
Audio and Video Signal Routing
PCMCIA Cards
Battery Operated Systems
Speaker Headset Switching
Audio and Video Signal Routing
PCMCIA Cards
Battery Operated Systems
DG2799 Connection Diagram
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