BU508DW, BU508DX, BU508L Selling Leads, Datasheet
MFG:PHI Package Cooled:TO-3P D/C:06+
BU508DW, BU508DX, BU508L Datasheet download
Part Number: BU508DW
MFG: PHI
Package Cooled: TO-3P
D/C: 06+
MFG:PHI Package Cooled:TO-3P D/C:06+
BU508DW, BU508DX, BU508L Datasheet download
MFG: PHI
Package Cooled: TO-3P
D/C: 06+
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PDF/DataSheet Download
Datasheet: BU508DW
File Size: 68965 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BU508DX
File Size: 58751 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BU500
File Size: 55598 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VCESM VCEO IC ICM IB IBM Ptot Tstg Tj |
Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature |
VBE = 0 V Ths 25 |
- |
1500 |
V |
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VCESM VCEO IC ICM IB IBM Ptot Tstg Tj |
Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature |
VBE = 0 V Ths 25 |
- |
1500 |
V |