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30LTSSOP, 30LV0032, 30LV0064

Table of contents:
Info of 30LTSSOP
Info of 30LV0032
Info of 30LV0064

30LTSSOP, 30LV0032, 30LV0064 Selling Leads, Datasheet

MFG:80 Package Cooled:TSOP D/C:09+

30LTSSOP, 30LV0032, 30LV0064 Datasheet download

Five Points

Part Number: 30LTSSOP

MFG: 80

Package Cooled: TSOP

D/C: 09+

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30LTSSOP General Description

STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.STATS ChipPAC's TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 56 leads. The ultra thin TSSOP is made possible by optimal wire looping control during the wire bonding process as well as optimal package warpage control during the molding process. TSSOP is designed to fill the niche of low pin count devices where low profile and small footprint are key design considerations. The TSSOP features 0.5 and 0.65mm lead pitch, and is ideal for low pin count analog and mixed signal devices in handheld applications such as PDAs and mobile / cellular phones.

Taking the reliability of Small Outline Packages (SOP) one step further, STATS ChipPAC offers a Micro Small Outline Package (MSOP) for applications requiring thin, small, and high reliability. This smaller package offers a smaller footprint, shorter wires for improved electrical connections, and better moisture reliability (MRT/MSL).

In addition to standard TSSOP and MSOP, STATS ChipPAC offers thermally enhanced "ep" versions featuring an exposed die paddle for efficient heat dissipation. The exposed die attach pad design of the TSSOP package can provide excellent thermal dissipation by soldering the copper die attach pad directly onto the PCB, and is ideal for low pin count analog and mixed signal devices.

STATS ChipPAC uses the latest leadframe technology and state of the art design and simulation tools to achieve
optimum electrical and thermal performance. STATS ChipPAC's state of the art assembly facility and proven materials assure high yield manufacturing and long term reliability.

30LTSSOP Features

TSSOP
· Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
· Lead Count: 8L to 56L
· Lead Pitch: 0.50mm & 0.65mm
· Package Height: 1.20mm max.
· JEDEC standard compliant (MO-153)
· Lead-free (Pb-free) and Green
· Thermal Enhancements: ep (exposed pad)
MSOP
· Body Size: 3 x 3mm
· Lead Count: 8L & 10L
· Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
· JEDEC standard compliant
· Lead-free (Pb-free) and Green
· Thermal enhancements: ep (exposed pad)

30LTSSOP Typical Application

• Analog and Operation Amplifiers
• Controllers and Drivers
• Logic, Memory, and RF/Wireless
• Disk drives, video/audio and consumer electronics/ appliances

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