24FC21MN6, 24FC256, 24FC256.I/SM Selling Leads, Datasheet
MFG:ST Package Cooled:06+ D/C:03+
24FC21MN6, 24FC256, 24FC256.I/SM Datasheet download
Part Number: 24FC21MN6
MFG: ST
Package Cooled: 06+
D/C: 03+
MFG:ST Package Cooled:06+ D/C:03+
24FC21MN6, 24FC256, 24FC256.I/SM Datasheet download
MFG: ST
Package Cooled: 06+
D/C: 03+
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PDF/DataSheet Download
Datasheet: 24FC1025
File Size: 327680 KB
Manufacturer: MICROCHIP
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 24FC256
File Size: 161722 KB
Manufacturer: Microchip
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 24FC1025
File Size: 327680 KB
Manufacturer: MICROCHIP
Download : Click here to Download
The Microchip Technology Inc. 24AA256/24LC256/24FC256 (24XX256*) is a 32K x 8 (256K bit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.8V to 5.5V). It has been developed for advanced, low power applications such as personal communications or data acquisition.
This device also has a page-write capability of up to 64 bytes of data. This device is capable of both random and sequential reads up to the 256K boundary. Functional address lines allow up to eight devices on the same bus, for up to 2M bit address space. This device is available in the standard 8-pin plastic DIP and 8-pin SOIC (208 mil) packages.
VCC.................................................................................................7.0V
All inputs and outputs w.r.t. VSS ............................ -0.6V to VCC +1.0V
Storage temperature ......................................... .....-65°C to +150°C
Ambient temp. with power applied...........................-65°C to +125°C
Soldering temperature of leads (10 seconds) .........................+300°C
ESD protection on all pins........................................................... 4 kV
*Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.