MOSFET N-CH 600V 3.6A TO-262
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Series: | - | Manufacturer: | Vishay Siliconix | ||
FET Type: | MOSFET N-Channel, Metal Oxide | Transistor Type: | - | ||
Gain : | 19.5 dB | Current - Collector (Ic) (Max): | - | ||
FET Feature: | Standard | Drain to Source Voltage (Vdss): | 600V | ||
Voltage - Collector Emitter Breakdown (Max): | - | Current - Continuous Drain (Id) @ 25° C: | 3.6A | ||
Vce Saturation (Max) @ Ib, Ic: | - | Current - Collector Cutoff (Max): | - | ||
Rds On (Max) @ Id, Vgs: | 2.2 Ohm @ 2.2A, 10V | DC Current Gain (hFE) (Min) @ Ic, Vce: | - | ||
Vgs(th) (Max) @ Id: | 4V @ 250µA | Gate Charge (Qg) @ Vgs: | 31nC @ 10V | ||
Frequency - Transition: | - | Input Capacitance (Ciss) @ Vds: | 660pF @ 25V | ||
Power - Max: | 3.1W | Mounting Type: | Through Hole | ||
Package / Case: | TO-262-3 Long Leads, I²Pak, TO-262AA | Supplier Device Package: | I2PAK |
Parameter |
Symbol |
Limit |
Unit | ||
Drain-Source Voltage |
VDS |
600 |
V | ||
Gate-Source Voltage |
VGS |
±20 |
V | ||
Drain Current-Continuous e | VGS at 10 V | TC=25 |
ID |
3.6 2.3 |
A |
TC=100 | |||||
Pulsed Drain Currenta e |
IDM |
14 |
A | ||
Linear Derating Factor |
0.59 |
W/ | |||
Single Pulse Avalanche Energyb e |
EAS |
290 |
mJ | ||
Repetitive Avalanche Currenta |
IAR |
3.6 |
A | ||
Repetitive Avalanche Energye |
EAR |
7.4 |
mJ | ||
Maximum Power Dissipation | TC=25 |
PD |
3.1 74 |
W | |
Ta=25 | |||||
Peak Diode Recovery dV/dtc |
dV/dt |
3.0 |
V/ns | ||
Operating Junction and S torage Temperature R ange |
TJ, TSTG |
-55 to 150 |
|||
Soldering Recommendations (Peak Temperature) | for 10 s |
300d |
Third generation Power MOSFETs from Vishay IRFBC30L provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK is a surface mount power package capable of the accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.
The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (IRFBC30L, SiHFBC30L) is a available for low-profile applications.