Features: ·Direct Replacement for HP 5082-3170· Isolation = 20 dB min. at 10 GHz·Hermetic PackageSpecifications IF 250 mA VR 150 V PDISS 1.75mW @ TC = 25 °C TJ -65 °C to +200 °C TSTG -65 °C to +150 °C JC 72 °C /mW DescriptionThe ASI 5082-3170 is a Silicon PIN Di...
ASI5082-3170: Features: ·Direct Replacement for HP 5082-3170· Isolation = 20 dB min. at 10 GHz·Hermetic PackageSpecifications IF 250 mA VR 150 V PDISS 1.75mW @ TC = 25 °C TJ -65 °C to +20...
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Features: • Gold contact metalization• Passivated ChipSpecifications I 100 mA ...
Features: • Transition Time 95 pS• Hermetic Glass PackageSpecifications IF 50 mA...
Features: • Transition Time 250 pS Typical• Hermetic Glass PackageSpecifications ...
IF | 250 mA |
VR | 150 V |
PDISS | 1.75mW @ TC = 25 °C |
TJ | -65 °C to +200 °C |
TSTG | -65 °C to +150 °C |
JC |
72 °C /mW |