Features: • High Performance 16-bit CPU with 5-Stage Pipeline 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution) 1-Cycle Multiplication (16 * 16 bit), Background Division (32 / 16 bit) in 21 Cycles 1-Cycle Multiply-and-Accumulate (MAC) Instructions Enhanced Boolean Bit...
XC161CJ: Features: • High Performance 16-bit CPU with 5-Stage Pipeline 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution) 1-Cycle Multiplication (16 * 16 bit), Background Divisio...
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• High Performance 16-bit CPU with 5-Stage Pipeline
25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution)
1-Cycle Multiplication (16 * 16 bit), Background Division (32 / 16 bit) in 21 Cycles
1-Cycle Multiply-and-Accumulate (MAC) Instructions
Enhanced Boolean Bit Manipulation Facilities
Zero-Cycle Jump Execution
Additional Instructions to Support HLL and Operating Systems
Register-Based Design with Multiple Variable Register Banks
Fast Context Switching Support with Two Additional Local Register Banks
16 Mbytes Total Linear Address Space for Code and Data
1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)
• 16-Priority-Level Interrupt System with 74 Sources, Sample-Rate down to 50 ns
• 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space
• Clock Generation via on-chip PLL (factors 1:0.15 . 1:10), or via Prescaler (factors 1:1 . 60:1)
• On-Chip Memory Modules
2 Kbytes On-Chip Dual-Port RAM (DPRAM)
4 Kbytes On-Chip Data SRAM (DSRAM)
2 Kbytes On-Chip Program/Data SRAM (PSRAM)
128 Kbytes On-Chip Program Memory (Flash Memory)
• On-Chip Peripheral Modules
12-Channel A/D Converter with Programmable Resolution (10-bit or 8-bit) and Conversion Time (down to 2.55 s or 2.15 s)
Two 16-Channel General Purpose Capture/Compare Units (32 Input/Output Pins)
Multi-Functional General Purpose Timer Unit with 5 Timers
Two Synchronous/Asynchronous Serial Channels (USARTs)
Two High-Speed-Synchronous Serial Channels
On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects
(Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality
Serial Data Link Module (SDLM), compliant with J1850, supporting Class 2
IIC Bus Interface (10-bit addressing, 400 kbit/s) with 3 Channels (multiplexed)
On-Chip Real Time Clock, Driven by Dedicated Oscillator
• Idle, Sleep, and Power Down Modes with Flexible Power Management
• Programmable Watchdog Timer and Oscillator Watchdog
• Up to 12 Mbytes External Address Space for Code and Data
Programmable External Bus Characteristics for Different Address Ranges
Multiplexed or Demultiplexed External Address/Data Buses
Selectable Address Bus Width
16-Bit or 8-Bit Data Bus Width
Five Programmable Chip-Select Signals
Hold- and Hold-Acknowledge Bus Arbitration Support
• Up to 99 General Purpose I/O Lines,partly with Selectable Input Thresholds and Hysteresis
• On-Chip Bootstrap Loader
•Supported by a Large Range of Development Tools like C-Compilers,Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers,Simulators, Logic Analyzer Disassemblers, Programming Boards
• On-Chip Debug Support via JTAG Interface
• 144-Pin TQFP Package, 0.5 mm (19.7 mil) pitch
Parameter |
Symbol |
Limit Values |
Uint |
Notes | |
min. |
max. | ||||
Storage temperature |
TST |
-65 |
150 |
°C |
- |
Junction temperature |
TJ |
-40 |
150 |
°C |
under bias |
Voltage on VDDI pins with respect to ground (VSS) |
VDDI |
-0.5 |
3.25 |
V |
- |
Voltage on VDDP pins with respect to ground (VSS) |
VDDP |
-0.5 |
6.2 |
V |
- |
Voltage on any pin with respect to ground (VSS) |
VIN |
-0.5 |
VDDP + 0.5 |
V |
- |
Input current on any pin during overload condition |
- |
-10 |
10 |
mA |
- |
Absolute sum of all input currents during overload condition |
- |
- |
|100| |
mA |
- |
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the voltage on VDDP pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings.