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WEDPNF8M721V-XBX

Features: Package:275 Plastic Ball Grid Array (PBGA), 32mm x 25mmCommercial, Industrial and Military Temperature RangesWeight:WEDPNF8M721V-XBX - 2.5 grams typicalSector ArchitectureOne 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte modeOne 8K word, two 4K words, one 16K word, andf...

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SeekIC No. : 004545617 Detail

WEDPNF8M721V-XBX: Features: Package:275 Plastic Ball Grid Array (PBGA), 32mm x 25mmCommercial, Industrial and Military Temperature RangesWeight:WEDPNF8M721V-XBX - 2.5 grams typicalSector ArchitectureOne 16KByte, two ...

WEDPNF8M721V-XBX Data Sheet

floor Price/Ceiling Price

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Part Number:
WEDPNF8M721V-XBX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/16

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Product Details

Description



Features:

 Package:
275 Plastic Ball Grid Array (PBGA), 32mm x 25mm
 Commercial, Industrial and Military Temperature Ranges
 Weight:
 WEDPNF8M721V-XBX - 2.5 grams typical
 Sector Architecture
 One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode
 One 8K word, two 4K words, one 16K word, andfifteen 32K word sectors in word mode.
 Any combination of sectors can be concurrentlyerased. Also supports full chip erase




Pinout

Connection Diagram


Specifications

Parameter   Unit
Supply Voltage Range (VCC) -0.5 to +4.0 V
Signal Voltage Range -0.5 to Vcc +0.5 V
Operating Temperature TA (Mil) -55 to +125 °C
Operating Temperature TA (Ind) -40 to +85 °C
Storage Temperature, Plastic -65 to +150 °C
Flash Endurance (write/erase cycles) 1,000,000 min. cycles



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