Features: Package:275 Plastic Ball Grid Array (PBGA), 32mm x 25mmCommercial, Industrial and Military Temperature RangesWeight:WEDPNF8M721V-XBX - 2.5 grams typicalSector ArchitectureOne 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte modeOne 8K word, two 4K words, one 16K word, andf...
WEDPNF8M721V-XBX: Features: Package:275 Plastic Ball Grid Array (PBGA), 32mm x 25mmCommercial, Industrial and Military Temperature RangesWeight:WEDPNF8M721V-XBX - 2.5 grams typicalSector ArchitectureOne 16KByte, two ...
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Features: · 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm· Package material and assembly process· Bal...
Features: · Registered for enhanced performace of bus speeds• 100, 125, 133MHz· Package:R...
Features: · Registered for enhanced performance of bus speeds• 100, 125, 133**MHz· Package:&...
Package:
275 Plastic Ball Grid Array (PBGA), 32mm x 25mm
Commercial, Industrial and Military Temperature Ranges
Weight:
WEDPNF8M721V-XBX - 2.5 grams typical
Sector Architecture
One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode
One 8K word, two 4K words, one 16K word, andfifteen 32K word sectors in word mode.
Any combination of sectors can be concurrentlyerased. Also supports full chip erase
Parameter | Unit | |
Supply Voltage Range (VCC) | -0.5 to +4.0 | V |
Signal Voltage Range | -0.5 to Vcc +0.5 | V |
Operating Temperature TA (Mil) | -55 to +125 | °C |
Operating Temperature TA (Ind) | -40 to +85 | °C |
Storage Temperature, Plastic | -65 to +150 | °C |
Flash Endurance (write/erase cycles) | 1,000,000 min. | cycles |