Features: · Registered for enhanced performance of bus speeds
• 100, 125, 133**MHz
· Package:
• 219 Plastic Ball Grid Array (PBGA), 25 x 25mm
· Single 3.3V ±0.3V power supply
· Fully Synchronous; all signals registered on positive edge of system clock cycle
· Internal pipelined operation; column address can be changed every clock cycle
· Internal banks for hiding row access/precharge
· Programmable Burst length 1,2,4,8 or full page
· 8,192 refresh cycles
· Commercial, Industrial and Military Temperature Ranges
· Organized as 16M x 72
· Weight: WEDPN16M72VR-XB2X - 2.5 grams typicalSpecifications
| Parameter |
|
Unit |
| Voltage on VCC, VCCQSupply relative to VSS |
-1 to 4.6 |
V |
| Voltage on NC or I/O pins relative to VSS |
-1 to 4.6 |
V |
| Operating Temperature TA (Mil) |
-55 to +125 |
|
| Operating Temperature TA (Ind) |
-40 to +85 |
|
| Storage Temperature, Plastic |
-55 to +125 |
|
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause per ma nent damage to the device. This is a stress rating only and func tion al op er a tion of the device at these or any other conditions greater than those in di cat ed in the operational sections of this specifi cation is not implied. Exposure to ab so lute maximum rating con di tions for extended periods may affect reliability.
DescriptionThe WEDPN16M72VR-XB2X is a high-speed CMOS,dynamic random-access, memory using 5 chips containing 268,435,456 bits. Each chip is internally confi gured as a quad-bank DRAM with a synchronous interface. Each of the chip's 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits. The MCP also incorporates two 16-bit universal bus drivers for input control signals and addresses.
Read and write accesses to the SDRAM are burst oriented;accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.
The WEDPN16M72VR-XB2X provides for programmable READ or WRITE burst lengths of 1, 2, 4 or 8 locations, or the full page, with a burst terminate option. An AUTO PRECHARGE function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence.
The WEDPN16M72VR-XB2X uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a high-speed, fully random access.
Precharging one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access operation.
The WEDPN16M72VR-XB2X is designed to operate in 3.3V, low-power memory systems. An auto refresh mode is provided, along with a power-saving, power-down mode.
All inputs and outputs of WEDPN16M72VR-XB2X are LVTTL compatible. SDRAMs offer substantial advances in DRAM operating performance,including the ability to synchronously burst data at a high data rate with automatic column-address generation,the ability to interleave between internal banks in order to hide precharge time and the capability to randomly change column addresses on each clock cycle during a burst access.
WEDPN16M72VR-XB2X Data Sheet
