Features: · 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm· Package material and assembly process· Ball pads diameter and ball attach process· Substrate dimensions, materal, process and thickness (no vias)· Die dimensions and thickness (dummy die, no wirebonds) 3 - State OutputsDescriptionThe WEDPDC32...
WEDPDC3225-B: Features: · 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm· Package material and assembly process· Ball pads diameter and ball attach process· Substrate dimensions, materal, process and thickness (no vi...
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Features: · Registered for enhanced performace of bus speeds• 100, 125, 133MHz· Package:R...
Features: · Registered for enhanced performance of bus speeds• 100, 125, 133**MHz· Package:&...
Features: ·High Frequency = 100, 125, 133MHz·Package:·219 Plastic Ball Grid Array (PBGA), 21 x 25m...
The WEDPDC3225-B is a mechaincal daisy-chain test vehicle designed to be representative of the 25 x 32mm, 25 x 25mm, 25 x 21mm, and 21 x 21mm packages. Use is for second level interconnection assembly test such tempature cycling, and continuity verifi cation of the PBGA to the test board when it is overfl owed.