Features: ·High Fre quen cy = 100, 125, 133MHz·Package:·219 Plas tic Ball Grid Ar ray (PBGA), 21 x 25mm·Single 3.3V ± 0.3V pow er sup ply·Fully Syn chro nous; all sg nals reg is tered on pos i tive edge of systm clock cycle·Internal pipelined operation; column address can be changed every clock cy...
WEDPN8M72V-XB2X: Features: ·High Fre quen cy = 100, 125, 133MHz·Package:·219 Plas tic Ball Grid Ar ray (PBGA), 21 x 25mm·Single 3.3V ± 0.3V pow er sup ply·Fully Syn chro nous; all sg nals reg is tered on pos i tive ...
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Features: · 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm· Package material and assembly process· Bal...
Features: · Registered for enhanced performace of bus speeds• 100, 125, 133MHz· Package:R...
Features: · Registered for enhanced performance of bus speeds• 100, 125, 133**MHz· Package:&...
Parameter | Unit | |
Voltage on VCC Supply relative to VSS Voltage on NC or I/O pins relative to VSS Operating Temperature TA (Mil) Operating Temperature TA (Ind) Storage Temperature, Plastic |
-1 to 4.6 -1 to 4.6 -55 to +125 -40 to +85 -55 to +125 |
V V °C °C °C |
NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause per ma nent damage to the device. This is a stress rating only and func tion alop er a tion of the device at these or any other conditions greater than those in di cat ed in the operational sections of this specifi cation is not implied. Exposure to ab so lute maximum rating con di tions for extended periods may affect reliability.