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WEDPN8M72V-XB2X

Features: ·High Fre quen cy = 100, 125, 133MHz·Package:·219 Plas tic Ball Grid Ar ray (PBGA), 21 x 25mm·Single 3.3V ± 0.3V pow er sup ply·Fully Syn chro nous; all sg nals reg is tered on pos i tive edge of systm clock cycle·Internal pipelined operation; column address can be changed every clock cy...

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WEDPN8M72V-XB2X: Features: ·High Fre quen cy = 100, 125, 133MHz·Package:·219 Plas tic Ball Grid Ar ray (PBGA), 21 x 25mm·Single 3.3V ± 0.3V pow er sup ply·Fully Syn chro nous; all sg nals reg is tered on pos i tive ...

WEDPN8M72V-XB2X Data Sheet

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Part Number:
WEDPN8M72V-XB2X
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/22

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Product Details

Description



Features:

·High Fre quen cy = 100, 125, 133MHz
·Package:
·219 Plas tic Ball Grid Ar ray (PBGA), 21 x 25mm
·Single 3.3V ± 0.3V pow er sup ply
·Fully Syn chro nous; all sg nals reg is tered on pos i tive edge of systm clock cycle
·Internal pipelined operation; column address can be changed every clock cycle
·Internal banks for hiding row access/precharge
·Programmable Burst length 1, 2, 4, 8 or full page
·4096 refresh cycles
·Commercial, Industrial and Military Temperature Rang es
·Organized as 8M x 72
·Weight: WEDPN8M72V-XB2X - 2 grams typical


Specifications

Parameter   Unit
Voltage on VCC Supply relative to VSS
Voltage on NC or I/O pins relative to VSS
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic		 -1 to 4.6
-1 to 4.6
-55 to +125
-40 to +85
-55 to +125		 V
V
°C
°C
°C

NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause per ma nent damage to the device. This is a stress rating only and func tion alop er a tion of the device at these or any other conditions greater than those in di cat ed in the operational sections of this specifi cation is not implied. Exposure to ab so lute maximum rating con di tions for extended periods may affect reliability.




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