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USB97C223

Features: Complete System Solution for interfacing SmartMediaTM (SM), Memory StickTM (MS), High Speed Memory Stick (HSMS), Memory Stick PRO (MSPRO), Secure Digital (SD), MultiMediaCardTM (MMC), NAND Flash, Compact FlashTM (CF) and CF form-factor ATA hard drives to USB 2.0 bus− Supports USB ...

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SeekIC No. : 004538820 Detail

USB97C223: Features: Complete System Solution for interfacing SmartMediaTM (SM), Memory StickTM (MS), High Speed Memory Stick (HSMS), Memory Stick PRO (MSPRO), Secure Digital (SD), MultiMediaCardTM (MMC), NAN...

USB97C223 Data Sheet

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Part Number:
USB97C223
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

Complete System Solution for interfacing  SmartMediaTM (SM), Memory StickTM (MS), High Speed Memory Stick (HSMS), Memory Stick PRO (MSPRO), Secure Digital (SD), MultiMediaCardTM (MMC), NAND Flash, Compact  FlashTM (CF) and CF form-factor ATA hard drives to USB 2.0 bus
− Supports USB Bulk Only Mass Storage Compliant Bootable BIOS
Support for simultaneous operation of all above devices. (only one at a time of each of the following groups supported: CF or ATA drive, SM or XD or NAND, SD or MMC)
On-Chip 4-Bit High Speed Memory Stick and MS PRO Hardware Circuitry
On-Chip firmware reads and writes High Speed Memory Stick and MS PRO
USB Bus Power Certified
3.3 Volt I/O with 5V input tolerance
Complete USB Specification 2.0 Compatibility for Bus Powered Operation
− Includes USB 2.0 Transceiver
− A Bi-directional Control and a Bi-directional Bulk Endpoint are provided.
8051 8 bit microprocessor
− Provides low speed control functions
− 30 Mhz execution speed at 4 cycles per instruction average
− 12K Bytes of internal SRAM for general purpose scratchpad
− 768 Bytes of internal SRAM for general purpose scratchpad or program execution while re-flashing
external ROM
Double Buffered Bulk Endpoint
− Bi-directional 512 Byte Buffer for Bulk Endpoint
− 64 Byte RX Control Endpoint Buffer
− 64 Byte TX Control Endpoint Buffer
Internal or External Program Memory Interface
− 64K Byte Internal Code Space or Optional 64K Byte External Code Space using Flash, SRAM or EPROM
memory.
On Board 12Mhz Crystal Driver Circuit
On-Chip 1.8V Regulator for Low Power Core Operation
Internal PLL for 480Mhz USB2.0 Sampling, Configurable MCU clock
Supports firmware upgrade via USB bus if "boot block" Flash program memory is used
15 GPIOs for special function use: LED indicators, button inputs, power control to memory devices, etc.
− Inputs capable of generating interrupts with either edge sensitivity
Compatible with Microsoft WinXP, WinME, Win2K SP3, Apple OS10 and Linux Multi-LUN Mass Storage Class Drivers
Win2K, Win98/98SE and Apple OS8.6 and OS9 Multi-LUN Mass Storage Class Drivers available from SMSC
128 Pin TQFP package; green, lead-free package also available (1.0mm height, 14mm x14mm footprint)


Specifications

Operating Temperature Range ..................................................................................................0 to +70
Storage Temperature Range .................................................................................................. -55o to +150
Lead Temperature Range (soldering, 10 seconds) .............................................................................+325
Positive Voltage on any pin, with respect to Ground ............................................................................... 5.5V
Negative Voltage on any pin, with respect to Ground ............................................................................ -0.3V
Maximum VDD, VDDP .............................................................................................................................. +2.5V
Maximum VDDIO, VDDA ............................................................................................................................ +4.0V
* Stresses above the specified parameters could cause permanent damage to the device. This is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this specification is not implied.
Notes:
When powering this device from laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. When this possibility exists, it is suggested that a clamp circuit be used.
The name "VDD" is the same as VDDCORE




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