UPSC603

Features: · High power surface mount package.· Silicon carbide Schottky rectifiers no reverse voltage recovery.· Internal heat sink locking tabs· Low forward voltage.· Full metallic bottom eliminates flux entrapment· Compatible with automatic insertion equipment· Low profile-maximum height of 1mm ...

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UPSC603 Picture
SeekIC No. : 004538435 Detail

UPSC603: Features: · High power surface mount package.· Silicon carbide Schottky rectifiers no reverse voltage recovery.· Internal heat sink locking tabs· Low forward voltage.· Full metallic bottom eliminate...

floor Price/Ceiling Price

Part Number:
UPSC603
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/22

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Product Details

Description



Features:

·  High power surface mount package.
·  Silicon carbide Schottky rectifiers no reverse voltage recovery.
·  Internal heat sink locking tabs
·  Low forward voltage.
·  Full metallic bottom eliminates flux entrapment
·  Compatible with automatic insertion equipment
·  Low profile-maximum height of 1mm supplied in 16 mm tape reel- 6000 units/ 13" reel.



Application

·  Switching and Regulating Power Supplies.
·  Charge Pump Circuits.
·  Reduces reverse recovery loss due to low IRM.
·  Small foot print
      190 X 300 mils
      1:1 Actual size



Specifications

Rating Symbol Value Unit
Maximum Reverse Voltage, UPSC203

Maximum Reverse Voltage, UPSC403

Maximum Reverse Voltage, UPSC603
V

V

V
200

400

600
Vdc

Vdc

Vdc
Maximum Average Output Current,
TTAB =75
T 4.0 Adc
Non-Repetitive Sinusoidal Surge Current
(8.3 mS)
I 15 A
Storage Temperature

Operating Temperature
Tstg

Top
-55 to +150

-55 to +150





Description

In Microsemi's new Powermite® 3 package, these high efficiency ultrafast rectifiers UPSC603 offer the power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite® 3 package features of UPSC603 include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device UPSC603 ideal for use with automatic insertion equipment.




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