Features: · High power surface mount package.· Silicon carbide Schottky rectifiers no reverse voltage recovery.· Internal heat sink locking tabs· Low forward voltage.· Full metallic bottom eliminates flux entrapment· Compatible with automatic insertion equipment· Low profile-maximum height of 1mm ...
UPSC603: Features: · High power surface mount package.· Silicon carbide Schottky rectifiers no reverse voltage recovery.· Internal heat sink locking tabs· Low forward voltage.· Full metallic bottom eliminate...
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Rating | Symbol | Value | Unit |
Maximum Reverse Voltage, UPSC203 Maximum Reverse Voltage, UPSC403 Maximum Reverse Voltage, UPSC603 |
V V V |
200 400 600 |
Vdc Vdc Vdc |
Maximum Average Output Current, TTAB =75 |
T | 4.0 | Adc |
Non-Repetitive Sinusoidal Surge Current (8.3 mS) |
I | 15 | A |
Storage Temperature Operating Temperature |
Tstg Top |
-55 to +150 -55 to +150 |
In Microsemi's new Powermite® 3 package, these high efficiency ultrafast rectifiers UPSC603 offer the power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.
In addition to its size advantages, Powermite® 3 package features of UPSC603 include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device UPSC603 ideal for use with automatic insertion equipment.