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UPSC200

Features: `High power surface mount package.`Silicon carbide Schottky rectifiers no reverse voltage recovery.`Internal heat sink locking tabs`Low forward voltage.`Full metallic bottom eliminates flux entrapment `Compatible with automatic insertion equipment`Low profile-maximum height of 1mm suppli...

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SeekIC No. : 004538430 Detail

UPSC200: Features: `High power surface mount package.`Silicon carbide Schottky rectifiers no reverse voltage recovery.`Internal heat sink locking tabs`Low forward voltage.`Full metallic bottom eliminates flu...

UPSC200 Data Sheet

floor Price/Ceiling Price

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Part Number:
UPSC200
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

`High power surface mount package. 
`Silicon carbide Schottky rectifiers no reverse voltage recovery.
`Internal heat sink locking tabs
`Low forward voltage.
`Full metallic bottom eliminates flux entrapment 
`Compatible with automatic insertion equipment
`Low profile-maximum height of 1mm supplied in 8mm tape and reel- 3,000 units/ 7" reel; 12,000 units/ 12"reel


Application

·Switching and Regulating Power Supplies.
·Charge Pump Circuits.
·Reduces reverse recovery loss due to low IRM.
· Small foot print    
                            100 X 105 mils
                            1:1 Actual size


Specifications

Rating

Symbol
Value
Unit
Maximum Reverse Voltage, UPSC200
V
200
Vdc
Maximum Reverse Voltage, UPSC400
V
400
Vdc
Maximum Reverse Voltage, UPSC600
V
600
Vdc
Maximum Average Output Current,
TTAB =75
T
1.0
Adc
Non-Repetitive Sinusoidal Surge Current
(8.3 mS)
I
10
A
Storage Temperature
Tstg
Top
-55 to +150
-55 to +150
Operating Temperature



Description

In Microsemi'snew Powermite® SMT package, these high efficiency ultrafast rectifiers UPSC200 offer the power handling abilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite® package features of UPSC200 include a full metallic bottom that eliminates the ibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design
makes this device ideal for use with automatic insertion equipment.




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