Features: `High power surface mount package.`Silicon carbide Schottky rectifiers no reverse voltage recovery.`Internal heat sink locking tabs`Low forward voltage.`Full metallic bottom eliminates flux entrapment `Compatible with automatic insertion equipment`Low profile-maximum height of 1mm suppli...
UPSC400: Features: `High power surface mount package.`Silicon carbide Schottky rectifiers no reverse voltage recovery.`Internal heat sink locking tabs`Low forward voltage.`Full metallic bottom eliminates flu...
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Rating |
Symbol |
Value |
Unit |
Maximum Reverse Voltage, UPSC200 |
V |
200 |
Vdc |
Maximum Reverse Voltage, UPSC400 |
V |
400 |
Vdc |
Maximum Reverse Voltage, UPSC600 |
V |
600 |
Vdc |
Maximum Average Output Current, TTAB =75 |
T |
1.0 |
Adc |
Non-Repetitive Sinusoidal Surge Current (8.3 mS) |
I |
10 |
A |
Storage Temperature |
Tstg Top |
-55 to +150 -55 to +150 |
|
Operating Temperature |
In Microsemi'snew Powermite® SMT package, these high efficiency ultrafast rectifiers UPSC400 offer the power handling abilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.
In addition to its size advantages, Powermite® package features of UPSC400 include a full metallic bottom that eliminates the ibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design
makes this device UPSC400 ideal for use with automatic insertion equipment.