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UPA837TF

Features: • SMALL PACKAGE OUTLINE:SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE:Just 0.60 mm high• TWO DIFFERENT DIE TYPES:Q1 - Ideal oscillator transistor Q2 - Ideal buffer amplifier transistorSpecifications SYMBOLS PARAMETERS UNITS RATINGS ...

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SeekIC No. : 004537914 Detail

UPA837TF: Features: • SMALL PACKAGE OUTLINE:SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE:Just 0.60 mm high• TWO DIFFERENT DIE TYPES:Q1 - Ideal oscillator transistor Q2 ...

UPA837TF Data Sheet

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Part Number:
UPA837TF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• SMALL PACKAGE OUTLINE:SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE:Just 0.60 mm high
• TWO DIFFERENT DIE TYPES:Q1 - Ideal oscillator transistor Q2 - Ideal buffer amplifier transistor


Specifications

SYMBOLS

          PARAMETERS

UNITS

RATINGS

      Q1 Q2

VCBO

Collector to Base Voltage

V

5

9

VCEO

Collector to Emitter Voltage

V

3

6

VEBO

Emitter to Base Voltage

V

2

2

IC

Collector Current

mA

10

100

 PT

Total Power Dissipation

 mW 110 110

200

TJ Junction Temperature   150 150
TSTG Storage Temperature   -65 to +150

 

 

 

 

 

 


Note: 1. Operation in excess of any one of these parameters may result in permanent damage.




Description

The UPA837TF contains one NE686 and one NE688 NPN high frequency silicon bipolar chip. NEC's new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.




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