Features: • SMALL PACKAGE STYLE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• EXCELLENT LOW VOLTAGE, LOW CURRENT PERFORMANCESpecifications SYMBOLS PARAMETERS UNITS RATINGS VCBO Collector to Base Voltage V 20 VCEO Collect...
UPA800TF: Features: • SMALL PACKAGE STYLE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• EXCELLENT LOW VOLTAGE, LOW CURRENT PERFORMANCESpecifications...
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SYMBOLS | PARAMETERS | UNITS | RATINGS |
VCBO | Collector to Base Voltage | V | 20 |
VCEO | Collector to Emitter Voltage | V | 10 |
VEBO | Emitter to Base Voltage | V | 1.5 |
IC | Collector Current | mA | 35 |
PT | Total Power Dissipation 1 Die 2 Die |
mW mW |
110 200 |
TJ | Junction Temperature | 150 | |
TSTG | Storage Temperature | -65 to +150 |
The UPA800TF contains two NE680 NPN high frequency silicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.