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UPA836TC

Features: • SMALL PACKAGE OUTLINE: 1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package• LOW HEIGHT PROFILE: Just 0.55 mm high• FLAT LEAD STYLE: Reduced lead inductance improves electrical performance• TWO DIFFERENT DIE TYPES: Q1 - Ideal oscillator transistor Q2 -...

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SeekIC No. : 004537912 Detail

UPA836TC: Features: • SMALL PACKAGE OUTLINE: 1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package• LOW HEIGHT PROFILE: Just 0.55 mm high• FLAT LEAD STYLE: Reduced lead inductance i...

UPA836TC Data Sheet

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Part Number:
UPA836TC
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• SMALL PACKAGE OUTLINE:
1.5 mm x 1.1 mm, 33% smaller than conventional
SOT-363 package
• LOW HEIGHT PROFILE:
Just 0.55 mm high
• FLAT LEAD STYLE:
Reduced lead inductance improves electrical
performance
• TWO DIFFERENT DIE TYPES:
Q1 - Ideal oscillator transistor
Q2 - Ideal buffer amplifier transistor


Pinout

Connection Diagram


Specifications

Symbol
Parameter
 Unit
Ratings
     
Q1
Q2
VEBO
 Collector to Base Voltage
V
9
9
VEBO
 Collector to Emitter Voltage
V
6
6
VEBO
 Emitter to Base Voltage
V
2
2
IC
 Collector Current
mW
30
100
PTNote
 Total Power Dissipation
mW
TBD
TBD
TBD
Tj
 Junction Temperature
°C
150
150
Tstg
 Storage Temperature
°C
-65 to +150



Description

The UPA836TC contains one NE685 and one NE688 NPN high frequency silicon bipolar chip. NEC's new ultra small TC package is ideal for all portable wireless applications where reducing board space is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/ buffer amplifier and other applications.




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