UPA834TF-T1

Features: • LOW NOISE: Q1:NF = 1.4 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA Q2:NF = 1.2 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• HIGH GAIN: Q1: |S21E|2 = 12.0 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA Q2: |S21E|2 = 9.0 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• 6-PIN THIN-TYPE...

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SeekIC No. : 004537909 Detail

UPA834TF-T1: Features: • LOW NOISE: Q1:NF = 1.4 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA Q2:NF = 1.2 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• HIGH GAIN: Q1: |S21E|2 = 12.0 dB TYP at f = 1 GHz, VCE...

floor Price/Ceiling Price

Part Number:
UPA834TF-T1
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• LOW NOISE:
   Q1:NF = 1.4 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA
   Q2:NF = 1.2 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA
• HIGH GAIN:
   Q1: |S21E|2 = 12.0 dB TYP at f = 1 GHz, VCE = 3 V,  lc = 7 mA
   Q2: |S21E|2 = 9.0 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA
• 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE
• 2 DIFFERENT BUILT-IN TRANSISTORS
   (Q1: NE681, Q2: NE856)



Specifications

SYMBOL PARAMETER RATINGS UNIT
    Q1 Q2  
VCBO Collector-base voltage 20 20 V
VCEO Collector-emitter voltage 10 12 V
VEBO Emitter-base voltage 1.5 3 V
IC Collector Current 65 100 mA
PT Collector power dissipation
150 150 mW
2002
Tj Junction temperature 150
TSTG Storage temperature -65to+150
Note: 1. Operation in excess of any one of these parameters may
result in permanent damage.
2. When operating both devices, the power dissipation for
either device should not exceed 110 mW.



Description

The UPA834TF-T1 has two different built-in transistors for low costamplifier and oscillator applications in the VHF/UHF band. Low noise figures, high gain, high current capability, and medium output give this device high dynamic range and excellent linearity for two-stage amplifiers. This device is also ideally suited for use in a VCO/buffer amplifier application. The thinner package style allows for higher density designs.




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