UPA831TC

Features:

• SMALL PACKAGE OUTLINE:
   1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package
• LOW HEIGHT PROFILE:
   Just 0.55 mm high
• FLAT LEAD STYLE:
   Reduced lead inductance improves electrical performance
• TWO DIFFERENT DIE TYPES:
   Q1 - Ideal oscillator transistor
   Q2 - Ideal buffer amplifier transistor

Specifications

Note:
1. Operation in excess of any one of these parameters may
result in permanent damage.

Description

The UPA831TC contains one NE856 and one NE681 NPN high frequency silicon bipolar chip. NEC's new ultra small TC package is ideal for all portable wireless applications where reducing board space is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.