UPA829TF

• SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE: Just 0.60 mm high
• HIGH COLLECTOR CURRENT:  I_C MAX = 100 mA

Note: 1.Operation in excess of any one of these parameters may result in permanent damage.

The UPA829TF contains two NE688 NPN high frequency ilicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.