UPA829TF

Features: • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• HIGH COLLECTOR CURRENT: IC MAX = 100 mASpecifications SYMBOLS PARAMETERS UNITS RATINGS VCBO Collector to Base Voltage V 9 V...

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SeekIC No. : 004537902 Detail

UPA829TF: Features: • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• HIGH COLLECTOR CURRENT: IC MAX = 100 mASpecifications ...

floor Price/Ceiling Price

Part Number:
UPA829TF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/4

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Product Details

Description



Features:

• SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE: Just 0.60 mm high
• HIGH COLLECTOR CURRENT:  IC MAX = 100 mA




Specifications

SYMBOLS
PARAMETERS
UNITS
RATINGS
VCBO
Collector to Base Voltage
V
9
VCEO
Collector to Emitter Voltage
V
6
VEBO
Emitter to Base Voltage
V
2
IC
Collector Current
mA
100
PT
Total Power Dissipation
1 Die
2 Die

mW
mW

110
200
TJ
Junction Temperature
150
TSTG
Storage Temperature
-65 to +150

Note: 1.Operation in excess of any one of these parameters may result in permanent damage.




Description

The UPA829TF contains two NE688 NPN high frequency ilicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.




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