Features: • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• HIGH COLLECTOR CURRENT: IC MAX = 100 mASpecifications SYMBOLS PARAMETERS UNITS RATINGS VCBO Collector to Base Voltage V 9 V...
UPA829TF: Features: • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• HIGH COLLECTOR CURRENT: IC MAX = 100 mASpecifications ...
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• SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE: Just 0.60 mm high
• HIGH COLLECTOR CURRENT: IC MAX = 100 mA
SYMBOLS |
PARAMETERS |
UNITS |
RATINGS |
VCBO |
Collector to Base Voltage |
V |
9 |
VCEO |
Collector to Emitter Voltage |
V |
6 |
VEBO |
Emitter to Base Voltage |
V |
2 |
IC |
Collector Current |
mA |
100 |
PT |
Total Power Dissipation 1 Die 2 Die |
mW |
110 200 |
TJ |
Junction Temperature |
150 | |
TSTG |
Storage Temperature |
-65 to +150 |
Note: 1.Operation in excess of any one of these parameters may result in permanent damage.
The UPA829TF contains two NE688 NPN high frequency ilicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator/buffer amplifier and other applications.