UPA826TC Selling Leads, Price trend, UPA826TC DataSheet download, circuit diagram from SeekIC.com

Features: • SMALL PACKAGE STYLE: 1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package• LOW HEIGHT PROFILE: Just 0.55 mm high• FLAT LEAD STYLE: Reduced lead inductance improves electrical performanceSpecifications SYMBOLS PARAMETERS UNITS RATINGS VCB...

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SeekIC No. : 004537897 Detail

UPA826TC: Features: • SMALL PACKAGE STYLE: 1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package• LOW HEIGHT PROFILE: Just 0.55 mm high• FLAT LEAD STYLE: Reduced lead inductance imp...

UPA826TC Data Sheet

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Part Number:: UPA826TC
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Upload time: 2024/11/22

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Recent History
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Product Details

Description

Features:

• SMALL PACKAGE STYLE: 1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package
• LOW HEIGHT PROFILE: Just 0.55 mm high
• FLAT LEAD STYLE: Reduced lead inductance improves electrical performance

Specifications

SYMBOLS	PARAMETERS	UNITS	RATINGS
V_CBO	Collector to Base Voltage	V	9
V_CEO	Collector to Emitter Voltage	V	6
V_EBO	Emitter to Base Voltage	V	2
I_C	Collector Current	mA	30
P_T	Total Power Dissipation
	1 Element	mW	TBD
	2 Elements	mW	TBD
T_J	Junction Temperature	°C	150
T_STG	Storage Temperature	°C	-65 to +150

Description

The UPA826TC contains two NE685 NPN high frequency silicon bipolar chips. NEC's new ultra small TC package is ideal for all portable wireless applications where reducing board space is a prime consideration. Each transistor chip is independently mounted and easily configured for oscillator buffer amplifier and other applications.

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UPA826TC

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