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UPA822TF

Features: • SMALL PACKAGE OUTLINE:SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE:Just 0.60 mm high• HIGH COLLECTOR CURRENT:IC MAX = 65 mASpecifications SYMBOLS PARAMETERS UNITS RATINGS VCBO Collector to Base Voltage V 20 VCEO...

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UPA822TF: Features: • SMALL PACKAGE OUTLINE:SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE:Just 0.60 mm high• HIGH COLLECTOR CURRENT:IC MAX = 65 mASpecifications ...

UPA822TF Data Sheet

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Part Number:
UPA822TF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• SMALL PACKAGE OUTLINE:SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE:Just 0.60 mm high
• HIGH COLLECTOR CURRENT:IC MAX = 65 mA


Specifications

SYMBOLS
PARAMETERS
UNITS
RATINGS
VCBO
 Collector to Base Voltage
V
20
VCEO
 Collector to Emitter Voltage
V
10
VEBO
 Emitter to Base Voltage
V
1.5
IC
 Collector Current
mA
65
PT
 Total Power Dissipation
1 Die
2 Die
mW
mW
110
200
TJ
 Junction Temperature
°C
150
TSTG
 Storage Temperature
°C
-65 to +150
Note: 1.Operation in excess of any one of these parameters may result in permanent damage.


Description

The UPA822TF contains two NE681 NPN high frequency silicon bipolar chips. NEC's new low profile TF package is ideal
for all portable wireless applications where reducing component height is a prime consideration. Each transistor chip is
independently mounted and easily configured for oscillator/ buffer amplifier and other applications.




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