Features: • LOW NOISE:NF = 1.2 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• HIGH GAIN:|S21E|2 = 9.0 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• SMALL PACKAGE STYLE:2 NE856 die in a 2 mm x 1.25 mm x 0.6 mm packagePinoutSpecifications SYMBOLS PARAMETERS UNITS RATINGS ...
UPA821TF: Features: • LOW NOISE:NF = 1.2 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• HIGH GAIN:|S21E|2 = 9.0 dB TYP at f = 1 GHz, VCE = 3 V, lc = 7 mA• SMALL PACKAGE STYLE:2 NE856 die in a 2 ...
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SYMBOLS |
PARAMETERS |
UNITS |
RATINGS | |
VCBO |
Collector to Base Voltage |
V |
20 | |
VCEO |
Collector to Emitter Voltage |
V |
12 | |
VEBO |
Emitter to Base Voltage |
V |
3 | |
IC |
Collector Current |
mA |
1000 | |
PT |
Total Power Dissipation |
mW mW |
150 | |
TJ | Junction Temperature | 150 | ||
TSTG | Storage Temperature | -65 to +150 |
Note:
1.Operation in excess of any one of these parameters may result in permanent damage.
2.When operating both devices, the power dissipation for either device should not exceed 110 mW.
The UPA821TF has two built-in low-voltage transistors which are designed for low-noise amplification in the VHF to UHF band. The two die are chosen from adjacent locations on the wafer. These features combined with the pin configuration make this device ideal for balanced or mirrored applications.Low noise figures, high gain, and high current capability equate to wide dynamic range and excellent linearity. The thinner package style allows for higher density designs.