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UPA814TF

Features: • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• HIGH COLLECTOR CURRENT: IC MAX = 100 mASpecifications SYMBOLS PARAMETERS UNITS RATINGS VCBO Collector to Base Voltage V 9 VCEO Collector to ...

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SeekIC No. : 004537892 Detail

UPA814TF: Features: • SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm• LOW HEIGHT PROFILE: Just 0.60 mm high• HIGH COLLECTOR CURRENT: IC MAX = 100 mASpecifications ...

UPA814TF Data Sheet

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Part Number:
UPA814TF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• SMALL PACKAGE OUTLINE: SOT-363 package measures just 2.0 mm x 1.25 mm
• LOW HEIGHT PROFILE: Just 0.60 mm high
• HIGH COLLECTOR CURRENT: IC MAX = 100 mA


Specifications

SYMBOLS PARAMETERS UNITS RATINGS
VCBO Collector to Base Voltage V 9
VCEO Collector to Emitter Voltage V 6
VEBO Emitter to Base Voltage V 2
IC Collector Current mA 100
PT Total Power Dissipation
1 Die
2 Die		 mW
mW		 110
200
TJ Junction Temperature 150
TSTG Storage Temperature -65 to +150
Note: 1.Operation in excess of any one of these parameters may result in permanent damage.


Description

The UPA814TF contains two NE688 NPN high frequency silicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.




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