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UPA808TC

Features: • SMALL PACKAGE OUTLINE:1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package • LOW HEIGHT PROFILE Just 0.55 mm high• FLAT LEAD STYLE:Reduced lead inductance improves electrical performance• HIGH COLLECTOR CURRENT:IC MAX = 65 mASpecifications SYMBOLS...

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SeekIC No. : 004537887 Detail

UPA808TC: Features: • SMALL PACKAGE OUTLINE:1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package • LOW HEIGHT PROFILE Just 0.55 mm high• FLAT LEAD STYLE:Reduced lead inductance imp...

UPA808TC Data Sheet

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Part Number:
UPA808TC
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/22

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Product Details

Description



Features:

• SMALL PACKAGE OUTLINE:1.5 mm x 1.1 mm, 33% smaller than conventional SOT-363 package
• LOW HEIGHT PROFILE Just 0.55 mm high
• FLAT LEAD STYLE:Reduced lead inductance improves electrical performance
• HIGH COLLECTOR CURRENT: IC MAX = 65 mA


Specifications

SYMBOLS PARAMETERS UNITS RATINGS
VCBO Collector to Base Voltage V 20
VCEO Collector to Emitter Voltage V 10
VEBO Emitter to Base Voltage V 1.5
IC Collector Current mA 65
PT Total Power Dissipation
1 Die
2 Die		 mW
mW		 TBD
TBD
TJ Junction Temperature °C 150
TSTG Storage Temperature °C -65 to +150



Description

The UPA808TC contains two NE687 NPN high frequency silicon bipolar chips. NEC's new ultra small TC package is ideal for all portable wireless applications where reducing board space is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascode LNAs and other applications.




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